Patents Assigned to Aptos Corp
  • Flexible multi-chip module and method of making the same
    Patent number: 7141875
    Abstract: A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: November 28, 2006
    Assignee: Aptos Corp
    Inventors: Min Chih Hsuan, Chi Shen Ho, Chang-Ming Lin, Kuolung Lei