Abstract: A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another cross-sectional area located underneath along its vertical thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.

Abstract: A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: A projection system and an image processing method thereof are provided. The system includes a projector module, a photography module and a processing module. The projector module projects a first image frame to an object surface. The photography module photographs the object surface to derive a second image frame including the first image frame and an indication point, wherein the indication point is formed by light projected on the object surface by an external device. The processing module analyzes the second image frame to derive coordinate of the indication point in the second image frame, derives coordinate of at least a feature point of the first image frame in the second image frame according to a linear-approximation method, and transforms the coordinates of the indication point in the second image frame to the coordinates in the first image frame by using two-dimensional coordinate transformation equations.

Abstract: A portable electronic device includes a base material, a fixing-cover and conductive terminals. The base material has first contact-pads and second contact-pads. The fixing-cover is disposed on a first surface and exposes the first contact-pads. The fixing-cover has a clamp portion. The terminals are disposed on the second contact-pads, wherein a first end of each the terminal extends out of the fixing-cover. A second end leans against the fixing-cover. A central portion is located between the two ends, wherein the bottom of the central portion bulges and contacts the corresponding second contact-pad, and the two ends can swing relatively to the base material around the bottom of the central portion as the pivot. The central portion has a positioning portion formed in direction facing the opening and the positioning portion is embedded in the opening.

Abstract: The invention is directed to a method of storing videos for a portable device having a buffer memory space and a storage device The method comprises recording a plurality of video frames and storing the video frames into the buffer memory space of the portable device and detecting an event. According to the event, a portion of the video frames recorded from a first predetermined time before the event is detected until the event is detected is restored into the storage device as a plurality of pre-event video frames and, meanwhile, a plurality of post-event video frames is continuously recorded for a second predetermined time after the event is detected and the post-event video frames are stored into the storage device, wherein the storage device is coupled to the portable device.

Abstract: A multi-interface memory card includes a memory card shell, and a first memory card module and a second memory card module installed within the shell, in which the first memory card module and the second memory card module respectively have a first module interface and a second module interface, matching the same standard memory card specification and exposing to the shell surface; the read/write device of the multi-interface memory card has a slot and a mainframe interface for being plugged by the multi-interface memory card; the read/write device includes a first connector and a second connector exposing to the inside surface of the slot to connect with the first module interface and the second module interface of the multi-interface memory card, respectively, and the multi-interface memory card is transferred to the mainframe through the mainframe interface, to form a read/write system implementing data access to the multi-interface memory card.

Abstract: A secure type storage device applies to data link with a mainframe, wherein the memory module thereof includes hidden and open storage spaces, for storing encrypted data and a file allocation table, respectively; the file allocation table registering storage location and property of the encrypted data accepts external queries, but the encrypted data does not be accessed through direct link; the secure type storage device and management software of the mainframe jointly implement the authentication process, respond the requirement issued by the mainframe after the read/write authorization is produced, access the hidden storage space, and decrypt and output the encrypted data to the mainframe, or receive and encrypt external information to store in the hidden storage space; thus, through the secure type storage device, the storage details is free checked, but the information does not be accessed arbitrarily, to prevent information from being arbitrarily modified or copied and spread.

Abstract: A composite memory card has 4-bit and 1-bit data transfer modes; in which, when the composite memory card plugs in a general reader, it operates in the 4-bit data transfer mode to form 4-bit format information signal linking with the external transfer through four data pins; and when it plugs in a dedicated reader, it operates in the 1-bit data transfer mode to form 1-bit format data signal linking with the external transfer through one data pin, while it starts the internal audio processing module to read the internal audio file streaming and to transform into voice output signal output to the dedicated reader through the other data pins for broadcast, and to receive the voice input signal of the dedicated reader through data pins to transform into audio file streaming to import for storage; thus, the composite memory card combines the standard memory card and the audio processing function.

Abstract: A memory card package structure includes a substrate having an antenna module; a first and second magnetic waveguiding layers respectively disposed on an upper surface and a lower surface of the substrate; a chip disposed on the first magnetic waveguiding layer and electrically connected with the substrate; and an encapsulation body encapsulating the chip, the first magnetic waveguiding layer and the upper surface of the substrate. A method for fabricating the memory card package structure is also provided. By directly disposing magnetic waveguiding material in the package structure, the thickness of the package structure is retained and yet the signal of an antenna module in the memory card package structure can be directed out along a horizontal direction, thereby extending the signal transmission distance.

Abstract: A portable electronic device includes a base material, a fixing-cover and conductive terminals. The base material has first contact-pads and second contact-pads. The fixing-cover is disposed on a first surface and exposes the first contact-pads. The fixing-cover has a clamp portion. The terminals are disposed on the second contact-pads, wherein a first end of each the terminal extends out of the fixing-cover. A second end leans against the fixing-cover. A central portion is located between the two ends, wherein the bottom of the central portion bulges and contacts the corresponding second contact-pad, and the two ends can swing relatively to the base material around the bottom of the central portion as the pivot. The central portion has a positioning portion formed in direction facing the opening and the positioning portion is embedded in the opening.

Abstract: A projection system and an image processing method thereof are provided. The system includes a projector module, a photography module and a processing module. The projector module projects a first image frame to an object surface. The photography module photographs the object surface to derive a second image frame including the first image frame and an indication point, wherein the indication point is formed by light projected on the object surface by an external device. The processing module analyzes the second image frame to derive coordinate of the indication point in the second image frame, derives coordinate of at least a feature point of the first image frame in the second image frame according to a linear-approximation method, and transforms the coordinates of the indication point in the second image frame to the coordinates in the first image frame by using two-dimensional coordinate transformation equations.

Abstract: A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.

Abstract: A bicycle burglarproof device includes a monitoring device and a warning device. The monitoring device detects a displacement of a bicycle, and wirelessly transmits a warning signal to the warning device once the displacement is identified as abnormal. Upon receiving the warning signal, the warning device notifies a user that an anomalous situation has happened via a recognizable signal generated by a prompting unit. The bicycle burglarproof device is capable of notifying the remote owner of the bicycle via a wireless communication module once an abnormal displacement of the bicycle is detected, so that the owner can immediately act to stop the burglary. In addition, the monitoring device is compactly designed and may be easily integrated with other bicycle accessories, so that it is less likely to catch the attention of burglars and get destroyed, thereby constant communication with the warning device may be maintained.