Abstract: A rinse solution for the treatment of conversion-coated metal substrates for improving the adhesion and corrosion resistance of siccative coatings, comprising an aqueous solution of zirconium ion and an organosilane selected from the group consisting of 3-glycidoxypropyltrimethoxysilane, methyltrimethoxysilane, .gamma.-methacryloxytrimethoxysilane, phenyltrimethoxysilane, and mixtures thereof, with the zirconium ion concentration selected to provide a pH about 2.0 to 9.0. A method for treating such materials by applying the rinse solution to the substrate.

Abstract: A metal dissolving liquid and method for stripping solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board, including an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, and a source of ammonium ions in an amount sufficient, in combination with the halide ions, to solubilize the tin and substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including benzotriazole and urea in amounts not more than about 2% by weight of each. The liquid wherein the source of ammonium ions includes ammonium bicarbonate.

Abstract: A positive photoresist stripper composition includes a solvent system having solubility parameters which fall within a range from about 8.5 to about 15 in an amount which falls within a range from about 65% to about 98%. An amine is present in an amount which falls within a range from about 2% to about 25%. A fatty acid having 8 to 20 carbon atoms is present in an amount which falls within a range from about 0.1% to about 10% (all percents being by weight). The amount of the amine and of the fatty acid are selected to provide a pH which falls in a range from about 6 to about 9.5. Positive photoresist is stripped from a substrate by immersing the substrate in the aforementioned composition. Metal deposited on the substrate is not attached by the composition.

Abstract: A composition and method for stripping solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board with a single application of the composition. An aqueous solution of nitric acid, ferric nitrate and sulfamic acid, which may be sprayed directly onto the printed circuit board for removing both the solder and the alloy.