Patents Assigned to ARE Corp.
  • Patent number: 8434115
    Abstract: An optical network terminal (ONT) is powered via a remote power supply. The remote power supply is connected to a standard customer premises electrical power outlet, providing a power source for power at a first format (e.g., 110 VAC). The remote power supply performs a power transformation to convert the power in the first power format to a second format (e.g., 48 VDC). This allows the powering of the ONT from farther distances, and thus allows for the easier installation of ONTs at customer premises which may not have optimally placed power outlets. A battery backup may also be used (either in parallel or serially), in order to provide availability of communications signals during a public power outage. When the battery backup used serially with the remote power supply, additional distance between the power outlet and the ONT may be accommodated.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: April 30, 2013
    Assignee: Verizon Services Corp.
    Inventor: Stanley Jo Wynman
  • Patent number: 8432464
    Abstract: A zoom lens includes, in order from the object side to the image side, a first lens unit having a positive refracting power and including a reflecting member having a reflecting surface, a second lens unit having a negative refracting power, a rear lens unit group having a positive refracting power as a whole and including at least three lens units, which includes in order from the object side, a third lens unit, a fourth lens unit, and a fifth lens unit. An aperture stop is provided between the second lens unit and the fourth lens unit. During zooming from the wide angle end to the telephoto end, the first lens unit is kept stationary, the second lens unit is located closer to the image side at the telephoto end than at the wide angle end, and the distances between the lens units change. The first lens unit includes, in order from the object side, a negative lens component, the reflecting member, and a rear sub-lens unit including a first positive lens element and a second positive lens element.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: April 30, 2013
    Assignee: Olympus Imaging Corp.
    Inventors: Masato Katayose, Kenji Ono, Hideyuki Nagaoka, Kazuhito Hayakawa
  • Patent number: 8432318
    Abstract: A capacitive antenna structure comprises a substrate and a sheet-shaped capacitor. The substrate has a radiating metal layer and a grounding metal layer thereon. The radiating metal layer has a first groove to expose the front surface of the substrate, the first groove having a signal feeding hole therein and having a second groove on the edge. The grounding metal layer has a third groove on the edge to expose the substrate, the third groove being opposite to the second groove, the third groove having a first contact and a second contact on two sides respectively to electrically connect to the capacitor. The third groove may connect to a fourth groove to expose the substrate, the fourth groove having a signal transmission line therein, and the signal transmission line having the signal feeding hole to connect a cable.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: April 30, 2013
    Assignee: Cirocomm Technology Corp.
    Inventors: Tsai-Yi Yang, Wei-Hung Hsu
  • Patent number: 8431519
    Abstract: A process for preparation of co-granules including one or more bleach activators and one or more bleach agent compounds is described. The bleach component is mixed and coated with a binder selected from the group of fatty acids, fatty acid polyol esters, polyglycols and fatty alcohol oxalkylates. One or more bleach activators is added to this mixture followed by granulation or agglomeration in a mixer, resulting in a bleach co-granule composition including the bleach activator and peroxide components.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: April 30, 2013
    Assignee: OCI Chemical Corp.
    Inventors: Robert Scarella, Georg Borchers
  • Patent number: 8431873
    Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: April 30, 2013
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Cheng-Tu Wang, Meng-Cheng Huang
  • Patent number: 8433037
    Abstract: A technique for generating three-dimensional information using radio frequency modulated X-rays includes both a method and an apparatus. In a first aspect, the method includes modulating an X-ray signal with first and second radio frequencies; transmitting the modulated X-ray signal; receiving backscatter; and processing the received backscatter to range a target in the field of view. In another aspect, an apparatus includes a transmitter and a receiver. The transmitter is capable of: modulating an X-ray signal with first and second radio frequencies and transmitting the modulated X-ray signal into a field of view. The receiver is capable of receiving backscatter from the transmitted X-ray signal. Other aspects include variations on these. For example, some aspects are computer implemented, such as a software implemented method, a program storage medium encoded with instruction to perform such a method, and a computing apparatus performed to program such a method.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: April 30, 2013
    Assignee: Lockheed Martin Corp
    Inventor: James Richard Wood
  • Patent number: 8431460
    Abstract: A semiconductor device comprising a silicon substrate, a gate structure and a heteroatom-containing epitaxial structure is provided. The gate structure is disposed on a surface of the silicon substrate. The heteroatom-containing epitaxial structure is disposed adjacent to the gate structure and has a major portion and an extension portion, wherein the major portion virtual vertically extends downwards into the silicon substrate from the surface; and the extension portion further extends downwards into the silicon substrate with a tapered cross-section continuing with the major portion.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: April 30, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Shin-Chuan Huang, Guang-Yaw Hwang, Hsiang-Ying Wang, Yu-Hsiang Hung, I-Chang Wang
  • Patent number: 8431929
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate disposed thereon, an insulation layer disposed on the substrate and overlying the gate, a patterned semiconductor layer disposed on the insulation layer, a source and a drain disposed on the patterned semiconductor layer, a protective layer overlying the insulation layer, the source and the boundary of the drain to expose a portion of the drain, and a pixel electrode disposed on the substrate, overlying the protective layer overlying the boundary of the drain, electrically connected to the exposed drain.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: April 30, 2013
    Assignee: AU Optronics Corp.
    Inventors: Kuo-Lung Fang, Chih-Chun Yang, Han-Tu Lin
  • Patent number: 8431925
    Abstract: Organic electronic devices, compositions, and methods are disclosed that employ electrically conductive nanowires and conducting materials such as conjugated polymers such as sulfonated regioregular polythiophenes which provide high device performance such as good solar cell efficiency. Devices requiring transparent conductors that are resilient to physical stresses can be fabricated, with reduced corrosion problems.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: April 30, 2013
    Assignees: Plextronics, Inc., Cambrios Technologies Corp.
    Inventors: Sergey B. Li, Shawn P. Williams, Brian E. Woodworth, Pierre Marc Allemand, Rimple Bhatia, Hash Pakbaz
  • Patent number: 8431226
    Abstract: Biologic coatings on a surface of a prosthesis or implantable device.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: April 30, 2013
    Assignee: Biomet Manufacturing Corp.
    Inventors: Frank Huerta, Jennifer Elisseeff, Norman Marcus
  • Patent number: 8433816
    Abstract: A system and method for interconnecting a plurality of processing element nodes within a scalable multiprocessor system is provided. Each processing element node includes at least one processor and memory. A scalable interconnect network includes physical communication links interconnecting the processing element nodes in a cluster. A first set of routers in the scalable interconnect network route messages between the plurality of processing element nodes. One or more metarouters in the scalable interconnect network route messages between the first set of routers so that each one of the routers in a first cluster is connected to all other clusters through one or more metarouters.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: April 30, 2013
    Assignee: Silicon Graphics International Corp.
    Inventors: Martin M. Deneroff, Gregory M. Thorson, Randal S. Passint
  • Patent number: 8433888
    Abstract: To minimize network access to a server in a network boot system. A server which stores an OS operating on a client terminal and a client terminal which includes a physical storage device are connected to each other over a network. The client terminal includes a physical memory and a network interface, and the OS includes a network driver for driving the network interface, a filter driver for converting access to a local bus of the client terminal into access to the network, and a read cache driver for driving the storage device. The read cache driver caches data which is read out from the server by the filter driver in the storage device.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: April 30, 2013
    Assignee: Co-Conv, Corp.
    Inventors: Shin Maruyama, Masahiro Kozuka
  • Patent number: 8429787
    Abstract: The present invention provides a cleaning assembly for use in a media processing device. In various embodiments, the cleaning assembly includes a first roller that at least partially engages a second roller, and a transport path that passes between the first roller and the second roller. There may also be a third collection roller that at least partially engages the second roller. The third collection roller may also engage a drive assembly that may be used to drive a media substrate along the transport path. In one embodiment, the second roller defines a surface adherence that is greater than a surface adherence of the first roller and the third collection roller defines a surface adherence that is greater than the surface adherence of the second roller and the drive assembly. As a result, the present invention provides a cleaning assembly capable of cleaning the drive assembly and opposed surfaces of a media substrate in a single pass.
    Type: Grant
    Filed: January 10, 2009
    Date of Patent: April 30, 2013
    Assignee: ZIH Corp.
    Inventors: Raymond Eugene Maynard, Michael Francis St. Germain, Thomas Richard Helma
  • Patent number: 8431487
    Abstract: A method for forming a plug structure includes the following steps. A substrate is provided. The substrate includes a MOS device with a source/drain region, a dielectric layer disposed on the MOS device, an opening defined in the dielectric layer, and a first glue layer disposed on a sidewall and a bottom of the opening. A portion of the first glue layer disposed at the bottom of the opening is punched through to expose the source/drain region. A barrier layer is formed over the substrate after the first glue layer is punched through. The opening is filled with a conductive structure, wherein the barrier layer disposed at the bottom of the opening is remained when the conductive structure is filled into the opening.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: April 30, 2013
    Assignee: United Microelectronics Corp.
    Inventor: Chao-Ching Hsieh
  • Patent number: 8432689
    Abstract: A rack mounted computer system. In one variation the computer rack is configured for side-by-side placement of computers. In another variation, the computer rack includes flanges for supporting the placement of computer units within the rack. In another variation the computer rack is configured with retaining clips. In yet another variation, the computer rack is configured to receive computers with chassis that are adapted for side-by-side placement.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: April 30, 2013
    Assignee: Silicon Graphics International Corp.
    Inventors: Giovanni Coglitore, Matthew P. Casebolt
  • Patent number: 8431932
    Abstract: A lower substrate for a liquid crystal display device and the method of making the same are disclosed. The method includes steps of: (a) providing a substrate; (b) forming a patterned transparent layer having plural recess on the substrate; (c) forming a first barrier layer on the surface of the recess; (d) coating a first metal layer on the first barrier layer and making the surfaces of the first metal layer and the transparent layer in substantially the same plane; and (e) forming a first insulated layer and a semi-conductive layer in sequence. The method further can optionally comprise the steps of: (f) forming a patterned second metal layer, wherein part of the semi-conductive layer is exposed, thus forming the source electrode and the drain electrode; and (g) forming a transparent electrode layer on part of the transparent layer and part of the second metal layer.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: April 30, 2013
    Assignee: AU Optronics Corp.
    Inventors: Yi-Wei Lee, Ching-Yun Chu
  • Patent number: 8432244
    Abstract: Disclosed is a power distribution transformer having a body of the transformer, the body consisting of a coil and an iron core; a tank containing the body of the transformer and an insulation substance which fills an inner space of the tank; and an upper lid of the tank. The tank and/or the upper lid is made of a ferritic stainless steel.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: April 30, 2013
    Assignees: Hitachi Industrial Equipment Systems Co., Ltd., Nippon Steel & Sumikin Stainless Steel Corp.
    Inventors: Masao Hosokawa, Mitsuaki Kawashima, Kazuyuki Fukui, Kouji Yamashita, Izumi Muto, Eiichiro Ishimaru, Hiroshige Inoue
  • Patent number: 8430363
    Abstract: A system (10) for sensing a condition of a rail vehicle undercarriage component (e.g., 18) includes a sensor (e.g., 12) comprising an array of infrared sensing elements (29). Each of the elements may be aimed at a different region of a target area (e.g., 32) of a rail vehicle undercarriage component to generate respective scanning waveform signature data corresponding to each different region. The sensor may be oriented so that at least one of the elements receives unobstructed infrared emissions (e.g., 33) from the undercarriage component of a rail vehicle passing the sensor. The system also includes a memory (42) for storing characteristic waveform signature data corresponding to known undercarriage components.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: April 30, 2013
    Assignee: Progress Rail Services Corp
    Inventors: Peter Hesser, Thomas Strecker, Miles Metschke, Thomas Shanahan, Daniel Kurt Stevens, Mathias Hartmann
  • Patent number: 8432089
    Abstract: A light source module and a backlight module therewith are disclosed. The light source includes a circuit board and a light-emitting diode disposed on the circuit board. The light-emitting diode includes a package unit and a conductive support. The package unit includes an insulation housing, a heat-dissipating support embedded in the insulation housing, and a light-emitting diode chip disposed on the heat-dissipating support and encapsulated by the insulation housing. The light-emitting diode chip includes two electrodes, which are isolated form the heat-dissipating support. The insulation housing thereon defines a light-out surface. The conductive support is disposed on an exterior side surface of the insulation housing and connected to the heat-dissipating support to protrude out the light-out surface.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 30, 2013
    Assignee: AU Optronics Corp.
    Inventors: Chan-Shung Yang, Su-Yi Lin, Cheng-Chuan Chen
  • Patent number: D680976
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: April 30, 2013
    Assignee: Lextar Electronics Corp.
    Inventors: Chia-En Lee, Te-Ling Hsia, Wen-Fei Fong