Patents Assigned to AREESYS CORPORATION
  • Publication number: 20140326182
    Abstract: A processing system includes a first processing module that includes a first chamber; and a first processing source that can deposit a first material on a web substrate. An isolation module includes an isolation chamber, and one or more segregation walls that define a sequence of compartments in the isolation chamber. The first chamber is connected to a first compartment in the sequence of compartments. Each of the segregation walls includes an opening to allow the web substrate to pass through. A second processing module includes a second chamber in connection with a last compartment in the sequence of compartments in the isolation module, and a second processing source configured to deposit a second material on the web substrate. A transport mechanism moves the web substrate continuously through the first processing module, the isolation module, and the second processing module.
    Type: Application
    Filed: April 11, 2014
    Publication date: November 6, 2014
    Applicant: Areesys Corporation
    Inventors: Kai-An Wang, Michael Z. Wong
  • Publication number: 20130287947
    Abstract: A deposition apparatus includes one or more evaporation sources each of which includes a container comprising an opening and configured to hold a source material, a source heater adjacent to and in thermal communication with the container, wherein the source heater is configured to elevate temperature of the source material to produce a vapor of the source material, and a source enclosure that encloses the container and the source heater. The source enclosure includes a vent configured to direct the vapor of the source material towards a substrate. The deposition apparatus includes also a plurality of substrate heaters in thermal communication with the substrate. The substrate includes a deposition surface configured to receive deposition of the source material by condensing the vapor. The plurality of substrate heaters can heat different portions of the substrate to different temperatures.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 31, 2013
    Applicant: AREESYS CORPORATION
    Inventors: Kai-An Wang, Albert Ting, Enhao Lin, Michael Wong