Abstract: A microduct manifold fitting includes an end cap, a gasket, a plurality of microduct couplers, a bottom portion, a top portion, and an optical enclosure attachment mechanism. The microduct manifold has a plurality of microduct openings disposed at a lower end and one fiber opening disposed at an upper end. The upper end of the microduct manifold extends into an opening of an optical enclosure and the optical enclosure attachment mechanism secures and seals the top portion to the optical enclosure. The optical enclosure is disposed in an outside environment, and the enclosure receives and splits an outside plant cable to individual fibers. The fibers are extended through the fiber opening of the microduct manifold, through the individual microducts via the microduct couplers, and to various optical equipment within a building that desire network connectivity. The microduct manifold shields fibers within the optical enclosure and microducts from the outside environment.
Type:
Grant
Filed:
July 9, 2019
Date of Patent:
February 2, 2021
Assignee:
ARIA Technologies, Inc.
Inventors:
Daniel Lewis Rodman, Ryan Michael Gilbert