Patents Assigned to Aries Electronics, Inc.
  • Patent number: 5730606
    Abstract: A universal production ball grid array socket is provided for use with a ball grid array package. The socket will receive a ball grid array package and in turn can be mounted or plugged into an underlying circuit board. One embodiment of the socket includes a tulip-shaped contact which is capable of receiving ball grid array ball leads of various diameters. Another embodiment of the socket includes a ball receiving contact capable of clasping an inserted ball grid array ball lead. In still another embodiment the universal production ball grid array socket is translucent allowing for visual inspection of a ball grid array package and ball grid array socket combination. Methods are provided for mounting a plurality of ball leads onto the bases of a plurality of ball receiving contacts after the contacts have been mounted within the universal production ball grid array socket.
    Type: Grant
    Filed: April 2, 1996
    Date of Patent: March 24, 1998
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 5729147
    Abstract: The terminal contact beams of a test or burn-in socket are provided with an abrasive surface to remove oxides or other films from the contact pins, lands, etc., of an electronic device package. The burn-in or test socket is in the form of a housing which holds the electronic device package by its terminal feet to prevent damage to the device package or mis-alignment of the terminal feet and moves the feet with respect to the terminal contact beams to assure good electrical connection therebetween.
    Type: Grant
    Filed: August 22, 1995
    Date of Patent: March 17, 1998
    Assignee: Aries Electronics, Inc.
    Inventor: Robert J. Schaff
  • Patent number: 5533665
    Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: July 9, 1996
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, James P. Walter
  • Patent number: 5427535
    Abstract: An electrical connector assembly is provided for releasable electrical connection of a high density memory module to a circuit board. An electrical connector assembly includes a base having an array of apertures extending therethrough for registration with both the contact pads of the memory module and of the circuit board. Resilient terminal assemblies are mounted in each of the apertures of the base. Each terminal assembly includes an electrically conductive terminal exposed at both ends of the terminal assembly and with a connection extending therebetween. The contacts and the connection of the terminal may be stamped and formed from a unitary strip of conductive metal. The terminal is insert molded in elastomeric material dimensioned to be frictionally retained in a corresponding aperture of the base.
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: June 27, 1995
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 5410452
    Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.
    Type: Grant
    Filed: February 18, 1994
    Date of Patent: April 25, 1995
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, James P. Walter
  • Patent number: 5329227
    Abstract: A universal LCC test socket assembly for making solderless connections between the leads of either a rectangular or square configured LCC packaged IC and a testing device includes a top member having spring biased securing members for temporarily securing a LCC packaged IC, and a base member including a plurality of electrical contacts that extend beyond the base member for electrical connection to the testing device.
    Type: Grant
    Filed: May 18, 1993
    Date of Patent: July 12, 1994
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 5092789
    Abstract: The invention disclosed herein relates to a test socket for making solderless connections between an electrical component and a printed circuit board. The socket includes a lid member that translates longitudinally with respect to a base member upon operating a cammed actuator. The lid member is connected to and guided upon the base member by a plurality of flexible linking clips. The invention includes a plurality of electrical connectors having a pair of resilient beams that are preloaded. A lead portion is formed from one of the opposed beams and extends unitarily therefrom.
    Type: Grant
    Filed: August 21, 1991
    Date of Patent: March 3, 1992
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 5057031
    Abstract: The invention disclosed herein relates to a test socket for making solderless connections between an electrical component and a printed circuit board. The socket includes a lid member that translates longitudinally with respect to a base member upon operating a cammed actuator. The lid member is connected to and guided upon the base member by a plurality of flexible linking clips. The invention includes a plurality of electrical connectors having a pair of resilient beams that are preloaded. A lead portion is formed from one of the opposed beams and extends unitarily therefrom.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: October 15, 1991
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4793058
    Abstract: A socket can be programmed to adapt the pin out configuration of an integrated circuit for convenient plug-in use or substitution in an environment, such as a socket, ordinarily intended for a similar integrated circuit with a different pin-out configuration. The invention includes a support, a first plurality of electrical contacts mounted in a prescribed pattern on one side of the support, a second plurality of electrical contacts mounted in a similar prescribed pattern on the other side of the support, at least some of the first contacts and some of the second contacts being electrically isolated from each other on the same and opposite sides of the support, and printed circuit traces and plated through holes coupling respective first contacts on one side of the support to respective second contacts on the other side of the support.
    Type: Grant
    Filed: May 2, 1986
    Date of Patent: December 27, 1988
    Assignee: Aries Electronics, Inc.
    Inventor: John T. Venaleck
  • Patent number: 4564253
    Abstract: Crimp-on connectors and housing are provided for a flat cable. The connectors may define either sockets or plugs. Each connector includes a cable mounting end affixed to a carrier strip. The cable mounting end has barbs for piercing the cable and a lance for aligning the cable. A contact end of each connector enables secure mounting of the connector in the housing. The housing is adapted to receive either a socket or plug connector.
    Type: Grant
    Filed: December 11, 1984
    Date of Patent: January 14, 1986
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4531795
    Abstract: An ejector socket for DIP jumpers is provided which includes a socket member and a pair of opposed latches. Each latch is pivotably mounted between a pair of locking arms which are disposed on opposed ends of the socket member. The locking arms cooperate with the respective latches to enable the latches to be lockingly retained in a position where the latches will securely maintain the DIP jumper in the subject ejector socket. The latches can be rotated out of their locked positions, thereby urging the DIP jumper out of the subject ejector socket. The socket member preferably is formed from a unitary piece of plastic.
    Type: Grant
    Filed: March 1, 1983
    Date of Patent: July 30, 1985
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4470289
    Abstract: An IC pin adjustment tool includes a pair of side arms and a center portion disposed between the side arms. The side arms are hingedly mounted on the center portion at one end thereof, and biased outwardly away from the center portion by spring means attached to the other end of the side arms. The center portion, and the portions of the side arms adjacent to the center portion, are configured such that an IC of either of two widths may be disposed on the associated one of two sides of the center portion such that the IC pins extend into gaps between the side arms and the center portion. By squeezing the side arms toward each other, the side arms force the pins toward the center portion to thereby adjust the orientation of the pins, such that they may immediately be inserted into an IC socket without further adjustment.
    Type: Grant
    Filed: April 29, 1982
    Date of Patent: September 11, 1984
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, Rocco F. Basile, Edward A. Kurz
  • Patent number: 4402563
    Abstract: A connector is disclosed for electrically interconnecting the conductive pins of an electrical component to a printed circuit board. The connector includes a plurality of conductive contacts mounted within a non-conductive housing. Each contact includes first and second upwardly extending arms spaced apart a distance sufficient to permit a conductive pin of the electical component to be freely mounted therebetween. The first arm of the contact is generally V-shaped in configuration and defines an intermediate projecting section, extending away from the second arm. A cammed closure is provided for exerting a force on the projecting section of the first arm in a direction towards the second arm. By this arrangement, after a conductive pin is mounted between the arms of the contact, the actuation of the cam causes the first arm of the contact to be moved into electrical contact with the conductive pin of the component.
    Type: Grant
    Filed: May 26, 1981
    Date of Patent: September 6, 1983
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4382652
    Abstract: A plurality of flat conductor cable connector assemblies according to the subject invention may be aligned in an abutting planar array such that the contacts of adjacent connector assemblies are spaced at 0.100 inch intervals corresponding to the 0.100 inch spacing between the individual contacts of each flat conductor cable connector assembly. Each of the latter includes a flat conductor cable having a plurality of uniformly spaced electrical conductors connected to the contacts which are disposed within the housing portion of a planar insulator block. The flat conductor cable is tapered adjacent said contacts, with the tapered width of the flat conductor cable corresponding to the tapered dimension of a tongue portion of the planar insulator block.
    Type: Grant
    Filed: January 19, 1981
    Date of Patent: May 10, 1983
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4225205
    Abstract: An electrical connector for terminating a flat conductor cable includes inherent strain relief means, and is constructed to facilitate interconnection of the conductors of the flat conductor cable to the terminal pins of the connector. The latter includes a plastic carrier having a central bar member which receives a parallel array of terminal pins, and formed unitary with the bar member are two planar cable support members. The latter are hingedly connected to the bar member such that they may be initially pivoted to a folded position to facilitate soldering of the terminal pins to the conductors of the flat conductor cable. Next, the planar support members may be pivoted about their hinge connections so as to engage the opposite surfaces of the flat conductor cable, where the planar support members are secured together.
    Type: Grant
    Filed: January 15, 1979
    Date of Patent: September 30, 1980
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, Joseph Argila
  • Patent number: 4200347
    Abstract: A socket for vertically mounting a light emitting diode relative to a generally horizontal printed circuit board includes an elongated housing for receiving the LED, and a triangular housing connected to the elongated housing. Aligned apertures extend through the elongated housing and the triangular housing, and a corresponding plurality of terminals are disposed in the aligned channels. The receptacle portion of each terminal is disposed in the elongated housing for engaging a pin of the LED, while the post portion extends through the channel and out of a side edge of the triangular housing, whereby the axes of the terminal post portions of the terminals are at an angle to the axes of the terminal receptacle portions. Since the terminals are wholly disposed within the socket, except for the terminal post portions, the terminals may be formed of a thin, stamped electrically conductive material.
    Type: Grant
    Filed: January 15, 1979
    Date of Patent: April 29, 1980
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, Joseph Argila
  • Patent number: 4187606
    Abstract: In a method for making a flexible electrical jumper, an elongated flat strip of electrically conductive material is die-cut to form a plurality of electrical leads interconnected by a carrier strip which extends along the longitudinal axis of the strip of conductive material. Each lead includes a central, flexible flat portion, and opposed contoured ends which are formed into generally U-shaped cross-sections. Sheets of insulative plastic material are laminated to the opposite sides of the central flat portion of the strip to embed the leads therein, with the contoured ends being exposed. The carrier strip is removed and the insulating material is cut at the desired locations, depending on the number of leads required for the flexible jumper. The method of the invention is carried out in a continuous operation, and the resulting flexible jumper is characterized by the exposed termination ends which are rigid and have generally arcuate, U-shaped cross-sections.
    Type: Grant
    Filed: May 8, 1978
    Date of Patent: February 12, 1980
    Assignee: Aries Electronics, Inc.
    Inventor: William Y. Sinclair
  • Patent number: 4090667
    Abstract: A shorting plug for selectively interconnecting contacts of an integrated circuit socket includes a housing for supporting a terminal pin assembly including a plurality of terminal pins corresponding to the number of contacts of the integrated circuit socket, with the terminal pins being electrically shorted together by electrically conductive bridges. Each bridge includes a removable portion that is partially pre-sheared so as to enable the removable portion to be broken out to arrange the paths of electricity in the terminal pin assembly in any desired pattern.
    Type: Grant
    Filed: May 13, 1977
    Date of Patent: May 23, 1978
    Assignee: Aries Electronics, Inc.
    Inventor: David J. Crimmins
  • Patent number: 4010992
    Abstract: A low profile socket for receiving an electronic multi-pin package is characterized by having a housing including a plurality of elongated channels, and a corresponding plurality of terminal pins. Each terminal pin includes a receptable portion that is disposed within a channel in the housing, and furthermore includes a post portion which extends from one side of the housing. Each channel includes a flexible membrane portion having an aperture through which the post of the terminal pin extends, with the aperture of the flexible membrane portion being smaller in cross-section than the cross-section of the post. Accordingly, when the terminal pin is fully inserted in the housing, the flexible membrane portion is flexed or stretched, and thereby forms a fluid type seal with the terminal post, thereby restricing liquid or foam flux and solder from entering the channel of the socket when the socket is being connected, such as by wave soldering, to the associated printed circuit board.
    Type: Grant
    Filed: January 8, 1976
    Date of Patent: March 8, 1977
    Assignee: Aries Electronics, Inc.
    Inventors: David J. Crimmins, William Y. Sinclair
  • Patent number: D300625
    Type: Grant
    Filed: July 14, 1986
    Date of Patent: April 11, 1989
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, Steven Miller