Abstract: A method for connecting terminals is provided. The method includes steps of a) providing a board having a first terminal thereon; b) performing a check of a heat treatment by using a thermal sensitive paper in order to determine a optimal condition of the heat treatment for the board; c) heating the first terminal under the optimal condition of the heat treatment; and d) connecting a second terminal to the heated first terminal.

Abstract: A liquid crystal display panel is provided. The liquid crystal display panel includes a first polarized substrate having a first surface and a second surface, a first alignment film mounted on the first surface, a first transparent electrode mounted between the first surface and the first alignment film, a second polarized substrate having a third surface and a fourth surface, a second alignment film mounted on the third surface, a second transparent electrode mounted between the third surface and the second alignment film and a liquid crystal layer, wherein the first polarized substrate and the second polarized substrate are so positioned that the first surface is near the third surface than the second surface, and the liquid crystal layer is placed therebetween.

Abstract: An apparatus for demounting and mounting for an integrated circuit, includes a base having a arm, a platform disposed on the base, a tooling head disposed on the arm, and a positioning device disposed on the base. The platform and the positioning device horizontally move together and a linking portion of a combination of a integrated circuit, and display, disposed on the platform and the positioning device, is moved under the tooling head and then pressed by the tooling head when the tooling head descends to press the linking portion. And both of the platform and the positioning device move back so that the tooling head scrapes the integrated circuit from the display.

Abstract: A liquid crystal display with metal electrodes is provided. The liquid crystal display includes a first substrate, a plurality of metal electrode layers formed on the first substrate, a plurality of transparent electrode layers formed on the metal electrode layers, and a second substrate coupled to the first substrate with a seal.

Abstract: A method for connecting terminals is provided. The method includes steps of a) providing a board having a first terminal thereon; b) performing a check of a heat treatment by using a thermal sensitive paper in order to determine a optimal condition of the heat treatment for the board; c) heating the first terminal under the optimal condition of the heat treatment; and d) connecting a second terminal to the heated first terminal.

Abstract: A cleaning device for cleaning a verge of a substrate by using a cleaning agent, includes a supporting structure and an absorber connected to the supporting structure. The substrate is cleaned by means of a contacting and a relative movement between the absorber and the substrate.