Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
Abstract: In accordance with the present invention compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
Type:
Grant
Filed:
August 1, 2008
Date of Patent:
June 5, 2012
Assignee:
Arlon
Inventors:
Sam Najjar, Chenghong Li, Thomas Allan Koes, Daniel Chang
Abstract: In accordance with the present invention, there are provided novel assemblies which are useful for a variety of applications. Invention assemblies have low dielectric constant, making them suitable for use in a variety of electronic applications. In addition, invention assemblies are resistant to attack by acidic aqueous media, basic aqueous media and/or organic media, making it possible to subject such assemblies to a variety of processing conditions, such as, for example, chemical etching to introduce circuitry thereto.
Type:
Grant
Filed:
October 17, 2002
Date of Patent:
March 9, 2004
Assignee:
Arlon
Inventors:
Chester Light Guiles, Scott Timon Allen, Ousama Najjar, William J. Bieschke