Abstract: A gas manifold includes a gas inlet surface having a first and second gas input port and a gas outlet surface. A first internal chamber is coupled to the first gas input port. A first plurality of gas conduits, each including an input coupled to the first internal chamber and an outlet at the gas outlet surface where a direction of at least one of the conduits in the first plurality of gas conduits relative to the gas outlet surface is different. A second internal chamber is coupled to the second gas input port and is isolated from the first internal chamber. A second plurality of gas conduits, each including an input coupled to the second internal chamber and an outlet at the gas outlet surface. A direction of at least one of the conduits in the second plurality of gas conduits relative to the gas outlet surface is different.

Abstract: A vacuum gauge protector for deposition systems includes a body comprising an input port that is configured to couple to a vacuum chamber, and an output port configured to couple to a vacuum gauge. A deposition material filter is positioned in the body to present a tortuous path to gases comprising deposition materials entering the body where the surface area of the deposition material filter is greater than 2000 mm2. In addition, the deposition material filter restricts deposition material from passing through the body to the output port so as to reduce vacuum gauge contamination while maintaining enough gas flow through the body to the output port so that the vacuum gauge response time can be less than 10 seconds.

Abstract: A gas manifold includes a gas inlet surface having a first and second gas input port and a gas outlet surface. A first internal chamber is coupled to the first gas input port. A first plurality of gas conduits, each including an input coupled to the first internal chamber and an outlet at the gas outlet surface where a direction of at least one of the conduits in the first plurality of gas conduits relative to the gas outlet surface is different. A second internal chamber is coupled to the second gas input port and is isolated from the first internal chamber. A second plurality of gas conduits, each including an input coupled to the second internal chamber and an outlet at the gas outlet surface. A direction of at least one of the conduits in the second plurality of gas conduits relative to the gas outlet surface is different.

Abstract: A gas manifold includes a gas inlet surface having a first and second gas input port and a gas outlet surface. A first internal chamber is coupled to the first gas input port. A first plurality of gas conduits, each including an input coupled to the first internal chamber and an outlet at the gas outlet surface where a direction of at least one of the conduits in the first plurality of gas conduits relative to the gas outlet surface is different. A second internal chamber is coupled to the second gas input port and is isolated from the first internal chamber. A second plurality of gas conduits, each including an input coupled to the second internal chamber and an outlet at the gas outlet surface. A direction of at least one of the conduits in the second plurality of gas conduits relative to the gas outlet surface is different.

Abstract: A vacuum gauge protector for deposition systems includes a body comprising an input port that is configured to couple to a vacuum chamber, and an output port configured to couple to a vacuum gauge. A deposition material filter is positioned in the body to present a tortuous path to gases comprising deposition materials entering the body where the surface area of the deposition material filter is greater than 2000 mm2. In addition, the deposition material filter restricts deposition material from passing through the body to the output port so as to reduce vacuum gauge contamination while maintaining enough gas flow through the body to the output port so that the vacuum gauge response time can be less than 10 seconds.

Abstract: A microchannel plate includes a substrate defining a plurality of channels extending from a top surface of the substrate to a bottom surface of the substrate. A resistive layer is formed over an outer surface of the plurality of channels that provides ohmic conduction with a predetermined resistivity that is substantially constant. An emissive layer is formed over the resistive layer. A top electrode is positioned on the top surface of the substrate. A bottom electrode positioned on the bottom surface of the substrate.