Patents Assigned to Art Technology, Inc.
  • Patent number: 10226959
    Abstract: A substrate processing device, which processes by immersing the substrate in the processing liquid comprising a mixture of a chemical and a diluting liquid, is provided with: a processing tank (1) that retains the processing liquid; heating means (2, 3) that heat the processing liquid; a temperature detection means (4) that detects the temperature of the processing liquid; a temperature control means (5) that operates the aforementioned heating means (2, 3) in a manner so that the detected temperature approaches a set temperature; a replenishing means (6) that replenishes the diluting liquid in the processing liquid; a concentration detection means (7) that detects the concentration of the processing liquid by measuring the light absorption characteristics of the processing liquid; and a concentration control means (8) that operates the aforementioned replenishing means (6) in a manner so that the detected concentration approaches a set concentration.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: March 12, 2019
    Assignees: Kurashiki Boseki Kabushiki Kaisha, Chemical Art Technology, Inc.
    Inventors: Hiromi Kiyose, Satoru Hiraki, Hiroshi Watanabe
  • Publication number: 20130240143
    Abstract: A substrate processing device, which processes by immersing the substrate in the processing liquid comprising a mixture of a chemical and a diluting liquid, is provided with: a processing tank (1) that retains the processing liquid; heating means (2, 3) that heat the processing liquid; a temperature detection means (4) that detects the temperature of the processing liquid; a temperature control means (5) that operates the aforementioned heating means (2, 3) in a manner so that the detected temperature approaches a set temperature; a replenishing means (6) that replenishes the diluting liquid in the processing liquid; a concentration detection means (7) that detects the concentration of the processing liquid by measuring the light absorption characteristics of the processing liquid; and a concentration control means (8) that operates the aforementioned replenishing means (6) in a manner so that the detected concentration approaches a set concentration.
    Type: Application
    Filed: July 21, 2011
    Publication date: September 19, 2013
    Applicants: CHEMICAL ART TECHNOLOGY, INC., KURASHIKI BOSEKI KABUSHIKI KAISHA
    Inventors: Hiromi Kiyose, Satoru Hiraki, Hiroshi Watanabe
  • Patent number: 8514170
    Abstract: A smaller sized flip dot display utilizes a magnetically actuated pixel that rotates between two orientations. The orientations display two different optical states. A simulated dot matrix design improves the aesthetics and consumer appeal, and also permits a flip dot display capable of producing a positive contrast display image with darker colored “ON” pixels contrasting with brighter background and “OFF” pixels by reducing the visibility of the spacing gap between each rotating pixel and the surrounding background. An interwoven configuration of magnetic actuators with a coil around each arm of a U-shaped core may result in lower power consumption, low production cost, and small size required for use in consumer and small mobile devices such as watches and mobile phones.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: August 20, 2013
    Assignee: Art Technology Inc.
    Inventors: Donald R. Brewer, David B. Cope, Andrew M. Wright, Christopher J. Corcoran
  • Patent number: 8158075
    Abstract: This invention intends to enable silicon compound to be removed from waste etching solution at a high removal rate and waste etching solution to be recycled without disposing it. The etching solution reproducing apparatus includes: temperature adjusting means for adjusting the temperature of taken out waste etching solution; atomizing means for atomizing waste etching solution adjusted in temperature by the temperature adjusting means; precipitating means for collecting waste etching solution atomized by the atomizing means and precipitating silicon compound in the waste etching solution; and separating means for separating silicon compound precipitated from the waste etching solution by the precipitating means so as to obtain reproduced etching solution.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: April 17, 2012
    Assignee: Chemical Art Technology Inc.
    Inventor: Hiroshi Watanabe
  • Patent number: 8156160
    Abstract: A method of generating a poet personality including reading poems, each of the poems containing text, generating analysis models, each of the analysis models representing one of poems and storing the analysis models in a personality data structure. The personality data structure further includes weights, each of the weights associated with each of the analysis models. The weights include integer values.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: April 10, 2012
    Assignee: Kurzweil Cyber Art Technologies, Inc.
    Inventors: Raymond Kurzweil, John A. Keklak
  • Patent number: 8117084
    Abstract: A method and apparatus for establishing a phone call between a potential customer viewing information on the internet and a sales agent includes the steps of receiving a message indicating that the customer wishes to be contacted and including contact information for the customer and other information, converting at least some of the information in the message to speech, establishing a phone call to the sales agents, playing the speech to the sales agent, establishing a phone call to the customer using the contact information in the message, and bridging the first call to the second call. In some embodiments, a text message such as email or SMS is sent in addition to the phone call to the sales agent or when the phone call to the sales agent cannot be completed.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: February 14, 2012
    Assignee: Art Technology, Inc.
    Inventor: Joseph Siegrist
  • Publication number: 20090049653
    Abstract: This invention intends to enable silicon compound to be removed from waste etching solution at a high removal rate and waste etching solution to be recycled without disposing it. The etching solution reproducing apparatus includes: temperature adjusting means for adjusting the temperature of taken out waste etching solution; atomizing means for atomizing waste etching solution adjusted in temperature by the temperature adjusting means; precipitating means for collecting waste etching solution atomized by the atomizing means and precipitating silicon compound in the waste etching solution; and separating means for separating silicon compound precipitated from the waste etching solution by the precipitating means so as to obtain reproduced etching solution.
    Type: Application
    Filed: November 7, 2007
    Publication date: February 26, 2009
    Applicant: CHEMICAL ART TECHNOLOGY INC.
    Inventor: Hiroshi WATANABE
  • Publication number: 20060231124
    Abstract: Provided is a processing method capable of reliably processing the inside of a depression such as a trench, a contact hole, a deep pattern, or a pore of a porous substrate. A chemical solution M is supplied into a processing bath 1 placing a substrate W, and the processing bath 1 is repetitively evacuated and pressurized several times at a pressure lower than the atmospheric pressure. Alcohol X is brought into contact with the surface of the substrate W and supplied into a depression W?1. The chemical solution M is supplied into the processing bath 1 containing the substrate W until the chemical solution M reaches a water level at which the substrate W is dipped, thereby allowing the chemical solution M to enter the depression W?1. The chemical solution M is discharged from the processing bath 1, and a portion of the chemical solution M entering the depression W?1 and mixed with the alcohol X is evaporated by evacuating the processing bath 1. This process is repeated several times.
    Type: Application
    Filed: May 15, 2006
    Publication date: October 19, 2006
    Applicants: Chemical Art Technology Inc., Cannon Kabushiki Kaisha
    Inventors: Hiroshi Watanabe, Tamotsu Mezaki, Shigeru Kido, Kiyofumi Sakaguchi
  • Publication number: 20040060574
    Abstract: Provided is a processing method capable of reliably processing the inside of a depression such as a trench, a contact hole, a deep pattern, or a pore of a porous substrate. A chemical solution M is supplied into a processing bath 1 placing a substrate W, and the processing bath 1 is repetitively evacuated and pressurized several times at a pressure lower than the atmospheric pressure. Alcohol X is brought into contact with the surface of the substrate W and supplied into a depression W-1. The chemical solution M is supplied into the processing bath 1 containing the substrate W until the chemical solution M reaches a water level at which the substrate W is dipped, thereby allowing the chemical solution M to enter the depression W-1. The chemical solution M is discharged from the processing bath 1, and a portion of the chemical solution M entering the depression W-1 and mixed with the alcohol X is evaporated by evacuating the processing bath 1. This process is repeated several times.
    Type: Application
    Filed: July 16, 2003
    Publication date: April 1, 2004
    Applicants: CHEMICAL ART TECHNOLOGY INC., CANON KABUSHIKI KAISHA
    Inventors: Hiroshi Watanabe, Tamotsu Mezaki, Shigeru Kido, Kiyofumi Sakaguchi
  • Patent number: D442907
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: May 29, 2001
    Assignee: Art Technologies, Inc.
    Inventor: Steven C. Santelman