Abstract: This invention generally relates to networks of communications devices, in particular ultra wideband (UWB) communications devices. An ultra-wideband (UWB) network comprising a plurality of UWB devices each forming a node of said network, pairs of said UWB devices being configured for communication with one another using one of a plurality of UWB channels, each said UWB device comprising a UWB transceiver for bidirectional communication over one or more of said UWB channels with at least one other of said UWB devices; and a device controller coupled to said UWB transceiver, said controller being configured to determine a said UWB channel for use in establishing a communication link with each other UWB device; whereby said network is configured for automatic construction of a set of communications links between said nodes of said network.

Abstract: This invention generally relates to wired and wireless ultra wideband (UWB) data communications apparatus and methods, and in particular to UWB receiver systems and architectures. An ultra wideband (UWB) receiver system comprising: a receiver front end to receive a UWB signal; an analogue-to-digital converter coupled to said receiver front end to digitize said received UBW signal; and a correlator coupled to said analogue-to-digital converter to correlate said digitized UWB signal with a reference signal.

Abstract: Described herein are ultra wideband (UWB) receiver systems, and applications thereof. Such a UWB receiver includes a receiver front end and a correlator coupled to the receiver front end. The receiver front end is configured to receive a UWB signal having a plurality of multipath components. The correlator is configured to correlate the UWB signal with a reference signal. The UWB signal includes a plurality of pulses, wherein each pulse has a plurality of multipath components. The reference signal also includes a plurality of multipath components of the pulse. The correlator includes at least one correlator module configured to correlate a plurality of the multipath components of the pulse with the reference signal.

Abstract: This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry and digital circuitry. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising: connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad. Preferably at least some of the bond pads for the digital circuitry are directly connected to the substrate pads, for example by wire bonding.

Abstract: Antennas for transmitting and receiving ultrawideband (UWB) signals are disclosed. A UWB antenna structure includes a planar conductor of substantially uniform resistance. The structure has the shape of a pair of conjoined, generally triangular figures, each with a long side, a short side, and a curved side. The triangular figures have an antenna feed connection at one corner. The structure has an axis of symmetry passing through the antenna feed connection.

Abstract: This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry and digital circuitry. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising: connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad. Preferably at least some of the bond pads for the digital circuitry are directly connected to the substrate pads, for example by wire bonding.

Abstract: A system and method uses near-field or inductively coupled UWB (Ultra Wide Band) systems to implement high speed electrical data connectors without the need for a direct electrical connection. A data connector system has a first connector portion and a second connector portion. The first connector portion comprises a UWB transmitter with a data input and a first UWB coupling element driven by the UWB transmitter. The second connector portion comprises a second UWB coupling element and a UWB receiver with a data output. The UWB receiver has an input from the second UWB coupling element. The data connector system has a connected configuration in which the first and second UWB coupling elements are within an operative range of one another, such that the coupling elements are inductively coupled to one another to permit data to be transferred from the data input to the data output, and a disconnected configuration in which the first and second connector portions are separated by greater than the operative range.