Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.
Type:
Grant
Filed:
July 9, 2001
Date of Patent:
June 17, 2003
Assignees:
Sumitomo Bakelite Company Limited, Artlite Kogyo Co., Ltd., UTK System Co., Ltd., C.R.T. Co., Ltd.