Patents Assigned to AS Electronics AG
  • Patent number: 12028963
    Abstract: Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: July 2, 2024
    Assignee: SCHWEIZER ELECTRONIC AG
    Inventor: Thomas Gottwald
  • Patent number: 12027332
    Abstract: In an embodiment a switching device includes two fixed contacts and a rotary contact bridge in a switching chamber in a gas-tight region, wherein the rotary contact bridge is rotatable about an rotation axis, wherein, in a first switching state, the fixed contacts are electrically conductively connected by the rotary contact bridge, wherein, in a second switching state, the rotary contact bridge is rotatable about the rotation axis relative to the first switching state, and the fixed contacts are electrically insulated from one another, and wherein the gas-tight region includes H2.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: July 2, 2024
    Assignee: TDK Electronics AG
    Inventors: Robert Hoffmann, Robert Minkwitz
  • Patent number: 12014852
    Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: June 18, 2024
    Assignee: TDK Electronics AG
    Inventors: Jan Ihle, Thomas Bernert, Gerald Kloiber
  • Patent number: 12012326
    Abstract: In an embodiment, a method for fabricating a Microelectromechanical System (MEMS) microphone includes depositing, on a frontside of a wafer, a first oxide layer over a silicon nitride thin film and over and adjacent the wafer, wherein the silicon nitride thin film is disposed over the wafer, depositing a membrane protection layer over the first oxide layer between a first side of a first cavity formed in the wafer and a second side of a second cavity formed in the wafer, depositing a second oxide layer over and adjacent the membrane protection layer, depositing a first membrane nitride layer over the second oxide layer, depositing a membrane polysilicon layer over the first membrane nitride layer, depositing a second membrane nitride layer over the membrane polysilicon layer, depositing a third oxide layer over the second membrane nitride layer and depositing a fourth oxide layer over the third oxide layer.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: June 18, 2024
    Assignees: TDK Electronics AG, TDK Corporation
    Inventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Tue Ravnkilde, Jotaro Akiyama
  • Patent number: 12005639
    Abstract: A 3D printer for additively manufacturing a multilayer component. The 3D printer includes at least two separate dispensers coating a conveyor belt with respectively different raw material, a manufacturing unit in which at least part of the raw material is added to the component as a new layer, at least two separate recovery devices for selectively recovering the respectively different raw material, which is not consumed when a layer is added to the component, and for returning the raw material to the respective associated dispenser, and conveyor belt that transports the raw material from the dispenser to the manufacturing unit and further to the recovery device in the lateral direction.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: June 11, 2024
    Assignee: TDK Electronics AG
    Inventors: Thomas Lenzen, Reinhard Neureiter, Christoph Recher
  • Patent number: 12009171
    Abstract: In an embodiment a switching device includes at least one stationary contact and a movable contact movable from a first switching state to a second switching state by a magnetic armature, wherein the magnetic armature has a spring configured to reset the movable contact from the second switching state to the first switching state, and wherein the spring has a first spring region with a first spring constant and a second spring region with a second spring constant which is greater than the first spring constant.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: June 11, 2024
    Assignee: TDK Electronics AG
    Inventor: Robert Hoffmann
  • Patent number: 12010787
    Abstract: A device including an electroceramic component having a first area and a second area, a potting compound at least partially surrounding the electroceramic component, and a sleeve-shaped housing which at least partially surrounds the potting compound. The housing has, in a first housing section that surrounds the potting compound in the first area of the electroceramic component, a material wherein the thermal conductivity of said material is greater than the thermal conductivity of a material of the housing in a second housing section. The housing in the second housing section surrounding the potting compound in the second area of the electroceramic component includes a non-conductive material.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: June 11, 2024
    Assignee: TDK Electronics AG
    Inventors: Robert Krumphals, Stefan Breuer, Daniel Neuwirth, Thomas Koidl
  • Patent number: 11996239
    Abstract: In an embodiment a capacitor includes a dielectric layer including a polyamideimide, the dielectric layer being uniform and a first electrode disposed directly adjacent to the dielectric layer.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: May 28, 2024
    Assignee: TDK Electronics AG
    Inventors: Birgit Six, Stefan Sax
  • Patent number: 11982353
    Abstract: In an embodiment a device includes a housing with at least a first housing part, a second housing part and an interior space at least partially surrounded by the first and second housing parts and a sealing element, wherein the first housing part includes a first sealing surface and the second housing part includes a second sealing surface, wherein the sealing element abuts the first sealing surface and the second sealing surface, wherein the sealing element has an inner surface in contact with the interior space and an outer surface in contact with a surrounding atmosphere of the housing, and wherein the sealing element includes a material through which gas is exchangeable between the interior space and the surrounding atmosphere.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: May 14, 2024
    Assignee: TDK Electronics AG
    Inventors: Bettina Milke, Andreas Breuer
  • Patent number: 11967444
    Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 23, 2024
    Assignee: TDK Electronics AG
    Inventors: Jan Ihle, Thomas Bernert, Gerald Kloiber
  • Patent number: 11958271
    Abstract: In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 16, 2024
    Assignee: TDK Electronics AG
    Inventors: Nele Reimer, Manfred Schweinzger
  • Patent number: 11961650
    Abstract: A coil arrangement with reduced losses and a stabilized coupling factor. For this purpose, the arrangement has a coil core and a first winding, the turns of which are distributed over several sections which are spaced apart from one another.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: April 16, 2024
    Assignee: TDK Electronics AG
    Inventor: Thomas Lohmann
  • Patent number: 11955301
    Abstract: In an embodiment a switching device includes at least one stationary contact, a movable contact, an armature, a first permanent magnet, a second permanent magnet and a magnetic switch, wherein the movable contact is movable by the armature, wherein the first permanent magnet is attached to the armature, and wherein the second permanent magnet is arranged in a fixed position relative to the magnetic switch.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: April 9, 2024
    Assignee: TDK Electronics AG
    Inventors: Frank Werner, Torsten Klinger
  • Patent number: 11955804
    Abstract: In an embodiment a load transfer element includes a bottom side, a top side and a connection between the bottom side and the top side, wherein the load transfer element is configured to transfer a mechanical load from a top side of a housing of a stationary part of a wireless power transfer (WPT) system to a bottom side of the housing.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: April 9, 2024
    Assignee: TDK Electronics AG
    Inventors: Pascal Hirschi, Abiezer Tejeda, Thomas Lohmann
  • Patent number: 11942280
    Abstract: A hybrid polymer aluminum electrolytic capacitor and a method for manufacturing a capacitor are disclosed.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 26, 2024
    Assignee: TDK Electronics AG
    Inventors: Norbert Will, László Dobai, Péter Kerepesi, Csaba Tóth
  • Patent number: 11942298
    Abstract: In an embodiment, a switching device includes at least one stationary contact, a movable contact, an armature, a permanent magnet and a magnetically-operated switch, wherein the movable contact is movable by the armature, wherein the permanent magnet is attached to the armature, and wherein the magnetically-operated switch is a Hall switch.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: March 26, 2024
    Assignee: TDK Electronics AG
    Inventors: Armin Grunack, Torsten Klinger
  • Patent number: 11935707
    Abstract: In an embodiment, a capacitor includes a winding element having a diameter of more than 10 mm, at least two tabs electrically contacted with an anode foil and at least two tabs electrically contacted with a cathode foil, wherein the capacitor is a hybrid polymer aluminum electrolytic capacitor, wherein the winding element is arranged inside a can having a can bottom, and wherein the can comprises a corrugation which fixes the winding element.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: March 19, 2024
    Assignee: TDK Electronics AG
    Inventors: Norbert Will, László Dobai, Péter Kerepesi, Csaba Tóth
  • Patent number: 11929211
    Abstract: A multi-layer capacitor including a capacitor element having at least two segments. Each segment includes multiple layer planes, including ceramic dielectric layers and electrode layers arranged therebetween, which are arranged in a layer sequence one above the other. The electrode layers include different electrodes, including at least first and second electrodes. The different electrodes overlap in active regions but not in passive regions. Multiple segments are arranged one above the other in a stack direction. The outermost dielectric layers of two segments form a connection region in which the segments are fixedly connected to each other parallel to the layer planes. The connection region contains a relief region. The relief region occupies at least the entire passive region of the capacitor.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: March 12, 2024
    Assignee: TDK Electronics AG
    Inventors: Thorsten Bayer, Michael Schossmann
  • Patent number: 11929193
    Abstract: An NTC compound, a thermistor and a method for producing a thermistor are disclosed. In an embodiment an NTC compound includes a ceramic material of a Mn—Ni—O system as a main constituent, wherein the Mn—Ni—O system has a general composition NixMn2O4-?, wherein y corresponds to a molar fraction of Ni of a total metal content of the ceramic material of the Mn—Ni—O system, which is defined as c(Ni):(c(Ni)+c(Mn)), and wherein the following applies: 0.500<x<0.610 and 0.197<y<0.240.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 12, 2024
    Assignee: TDK Electronics AG
    Inventor: Michael Naderer
  • Patent number: 11915872
    Abstract: A ceramic component having a ceramic main part containing AxByC1?x?vTi1?y+wO3*(Mn2P2O7)z*Du, in which A is a first dopant selected from a group including neodymium, praseodymium, cerium, and lanthanum, B is a second dopant selected from a group including niobium, tantalum, and vanadium, C is selected from a group including calcium, strontium, and barium, and D includes a metal selected from a group including aluminum, nickel, and iron. x is the proportion of A, y is the proportion of B, v is the proportion of A vacancies, w is the proportion of excess titanium, z is the proportion of Mn2P2O7, u is the proportion of D, and the following applies: 0.0?x<0.1, 0.0?y<0.1, 0?v<1.5*x, 0?w<0.05, 0.01?z<0.1, 0?u<0.05. A method for producing the ceramic component is also disclosed.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: February 27, 2024
    Assignee: TDK Electronics AG
    Inventors: Uwe Wozniak, Hermann Grünbichler