Patents Assigned to Asahi Denka Kenkyusho Co., Ltd.
  • Patent number: 11060191
    Abstract: A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: July 13, 2021
    Assignee: ASAHI DENKA KENKYUSHO CO., LTD.
    Inventor: Masanori Mizoguchi
  • Publication number: 20190218667
    Abstract: A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.
    Type: Application
    Filed: February 22, 2018
    Publication date: July 18, 2019
    Applicant: ASAHI DENKA KENKYUSHO CO., LTD.
    Inventor: Masanori MIZOGUCHI
  • Patent number: 9466905
    Abstract: A device including male and female connectors each including mounting pad terminals arranged on both side portions of a surface mounted on a circuit board, and a connector structure. The female connector includes: an insulating film; pad portions formed on one surface of the insulating film; a metal guide member fixedly disposed to cover the other surface of the insulating film and insulatingly coated; female terminal portions including slit openings penetrating in a thickness direction through the pad portions and portions of the insulating film; through-holes penetrating through the metal guide member; and mounting pad terminals formed on both side portions of the other surface of the insulating film, with surfaces projecting more than a surface of the metal guide member and electrically connected to the pad portions respectively. The connector structure includes male terminal portions inserted to the slit openings from the female connector's one surface side.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: October 11, 2016
    Assignee: ASAHI DENKA KENKYUSHO CO., LTD.
    Inventors: Masanori Mizoguchi, Ryu Maeda
  • Publication number: 20150295334
    Abstract: A device including male and female connectors each including mounting pad terminals arranged on both side portions of a surface mounted on a circuit board, and a connector structure. The female connector includes: an insulating film; pad portions formed on one surface of the insulating film; a metal guide member fixedly disposed to cover the other surface of the insulating film and insulatingly coated; female terminal portions including slit openings penetrating in a thickness direction through the pad portions and portions of the insulating film; through-holes penetrating through the metal guide member; and mounting pad terminals formed on both side portions of the other surface of the insulating film, with surfaces projecting more than a surface of the metal guide member and electrically connected to the pad portions respectively. The connector structure includes male terminal portions inserted to the slit openings from the female connector's one surface side.
    Type: Application
    Filed: October 24, 2013
    Publication date: October 15, 2015
    Applicant: ASAHI DENKA KENKYUSHO CO., LTD.
    Inventors: Masanori Mizoguchi, Ryu Maeda
  • Patent number: 8267700
    Abstract: A connector structure which can realize height reduction of connecting portions and space saving and which prevents separation of a female connector and a male connector from each other due to an impact or vibrations, wherein a conduction structure is formed by bringing connecting pins (9) of a male connector (B2), which are inserted in female terminal portions installed in a flexible circuit board (B3) of a female connector (B1), into pressure contact with pad portions of the female terminal portions (3), and the female connector (B1) and the male connector (B2) are coupled with each other by inserting column-shaped projections (15) of the male connector (B2) into notch ring bodies (14) fixed on the flexible circuit board (B3) of the female connector (B1) and holding the column-shaped projections (15) by restoring force based on elastic deformation of the notch ring bodies (14).
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: September 18, 2012
    Assignee: Asahi Denka Kenkyusho Co., Ltd.
    Inventor: Masanori Mizoguchi
  • Patent number: 8215965
    Abstract: A female connector which is useful for space saving and height reduction of a connector connection portion is a female connector including: an insulating film having flexibility; a plurality of pad portions formed at predetermined positions on one face of the insulating film in an arranged manner; female terminal portions composed of openings formed at one lateral portions within faces of the pad portions so as to extend up to the other face of the insulating film; and spacer bumps formed at positions corresponding to the other lateral positions within the faces of the pad portions in a standing manner within the other face of the insulating film, proximal portions of the spacer bumps being electrically connected to the pad portions.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: July 10, 2012
    Assignee: Asahi Denka Kenkyusho Co., Ltd.
    Inventor: Masanori Mizoguchi
  • Publication number: 20110269321
    Abstract: A connector structure which can realize height reduction of connecting portions and space saving and which prevents separation of a female connector and a male connector from each other due to an impact or vibrations, wherein a conduction structure is formed by bringing connecting pins (9) of a male connector (B2), which are inserted in female terminal portions installed in a flexible circuit board (B3) of a female connector (B1), into pressure contact with pad portions of the female terminal portions (3), and the female connector (B1) and the male connector (B2) are coupled with each other by inserting column-shaped projections (15) of the male connector (B2) into notch ring bodies (14) fixed on the flexible circuit board (B3) of the female connector (B1) and holding the column-shaped projections (15) by restoring force based on elastic deformation of the notch ring bodies (14).
    Type: Application
    Filed: May 7, 2009
    Publication date: November 3, 2011
    Applicant: Asahi Denka Kenkyusho Co., Ltd.
    Inventor: Masanori Mizoguchi
  • Publication number: 20110039427
    Abstract: A female connector which is useful for space saving and height reduction of a connector connection portion is a female connector including: an insulating film having flexibility; a plurality of pad portions formed at predetermined positions on one face of the insulating film in an arranged manner; female terminal portions composed of openings formed at one lateral portions within faces of the pad portions so as to extend up to the other face of the insulating film; and spacer bumps formed at positions corresponding to the other lateral positions within the faces of the pad portions in a standing manner within the other face of the insulating film, proximal portions of the spacer bumps being electrically connected to the pad portions.
    Type: Application
    Filed: April 24, 2009
    Publication date: February 17, 2011
    Applicant: Asahi Denka Kenkyusho Co., Ltd.
    Inventor: Masanori Mizoguchi
  • Patent number: 7785113
    Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: August 31, 2010
    Assignee: Asahi Denka Kenkyusho Co., Ltd.
    Inventor: Masanori Mizoguchi