Patents Assigned to Asahi Engineering K.K.
  • Resin encapsulation system
    Patent number: 6908293
    Abstract: In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: June 21, 2005
    Assignees: NEC Electronics Corporation, Asahi Engineering K.K.
    Inventors: Ichirou Furuta, Akira Kajiwara