Abstract: A lens for light emitting lamps that use light emitting elements such as LEDs, etc., is provided. The lens has a specific surface shape for light-distribution control to achieve desired light distributions, as well as a light emitting device using said lens. On the lens surface of the light emitting side which has a double-peak shape to obtain a light distribution characteristic having long and short two axes, by possessing a straight-line part in the surface shape of the light emitting side viewed on the lens short-axis cross section, a desired smoothly-diffused light distribution having a longitudinal direction with a certain width is obtained. The lens may be designed to have a surface of the light emitting side comprising a collection of straight lines parallel to the lens short-axis cross section, or to have a continuous curved surface comprising a collection of straight lines parallel to the lens short axis.

Abstract: There is provided an ink for white reflective film formation including: a liquid binder resin component containing a crosslinkable silicone liquid resin and crosslinkable silicone resin particles; and titanium oxide particles, the ink containing 10 to 500 parts by mass of the titanium oxide particles relative to a solid content of a total of 100 parts by mass in the liquid binder resin component.

Abstract: There is provided an ink for white reflective film formation including: a liquid binder resin component containing a crosslinkable silicone liquid resin and crosslinkable silicone resin particles; and titanium oxide particles, the ink containing 10 to 500 parts by mass of the titanium oxide particles relative to a solid content of a total of 100 parts by mass in the liquid binder resin component.

Abstract: A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

Abstract: A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

Abstract: LED lighting device in which color-mixed light according to a mixture of a blue optical emission spectrum according to the emission from an LED element, a red optical emission spectrum according to the emission from a red phosphor, and a green optical emission spectrum according to the emission from a green phosphor is emitted, wherein in the spectrum for the emitted color-mixed light, letting the relative spectral area for the principal-wavelength peak of the blue optical emission spectrum be AB and the peak emission intensity be IB, letting the relative spectral area of the green optical emission spectrum be AG and the peak emission intensity be IG, and letting the relative spectral area of the red optical emission spectrum be AR and the peak emission intensity be IR, then IB<IG, IB<IR, AB?AG, AB?AR, and AB/(AR+AG)?0.4.

Abstract: There is provided an ink for white reflective film formation including: a liquid binder resin component containing a crosslinkable silicone liquid resin and crosslinkable silicone resin particles; and titanium oxide particles, the ink containing 10 to 500 parts by mass of the titanium oxide particles relative to a solid content of a total of 100 parts by mass in the liquid binder resin component.

Abstract: A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.

Abstract: LED lighting device in which color-mixed light according to a mixture of a blue optical emission spectrum according to the emission from an LED element, a red optical emission spectrum according to the emission from a red phosphor, and a green optical emission spectrum according to the emission from a green phosphor is emitted, wherein in the spectrum for the emitted color-mixed light, letting the relative spectral area for the principal-wavelength peak of the blue optical emission spectrum be AB and the peak emission intensity be IB, letting the relative spectral area of the green optical emission spectrum be AG and the peak emission intensity be IG, and letting the relative spectral area of the red optical emission spectrum be AR and the peak emission intensity be IR, then IB<IG, IB<IR, AB?AG, AB?AR, and AB/(AR+AG)?0.4.

Abstract: A general-use white color reflecting material, and a process for production thereof are provided. The white color reflecting material, without troublesome surface treatment such as formation of a reflective layer by plating, is capable of reflecting a near-ultraviolet ray of a wavelength region of 380 nm or longer or a near-infrared ray sufficiently without light leakage; does not become yellow even when exposed to near-ultraviolet rays; has excellent lightfastness, heat resistance, and weatherability; has high mechanical strength and chemical stability; is capable of maintaining a high degree of whiteness; and is easily moldable at a low cost. Further a white color reflecting material used as an ink composition for producing the white color reflecting material in a film shape is also provided.

Abstract: Provided is a small, simple-structured, homogeneous and mass-producible excessive pressure release valve which works even at a relatively low excessive pressure to surely and safely release the pressure to the external world. The excessive pressure release valve has an elastic rubber plate and a reversibly openable slit that passes through the upper and the lower surfaces and release the pressure to the external world when the internal excessive pressure stressing on the lower side surface, pushes and opens the slit toward upper surface side. The elastic rubber plate is made of silicone rubber containing 1-20% by mass of silicone oil.

Abstract: A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

Abstract: A general-use white color reflecting material, and a process for production thereof are provided. The white color reflecting material, without troublesome surface treatment such as formation of a reflective layer by plating, is capable of reflecting a near-ultraviolet ray of a wavelength region of 380 nm or longer or a near-infrared ray sufficiently without light leakage; does not become yellow even when exposed to near-ultraviolet rays; has excellent lightfastness, heat resistance, and weatherability; has high mechanical strength and chemical stability; is capable of maintaining a high degree of whiteness; and is easily moldable at a low cost. Further a white color reflecting material used as an ink composition for producing the white color reflecting material in a film shape is also provided.

Abstract: A base material for adhesion to be adhered to a solid body includes a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.

Abstract: A base material for adhesion to be adhered to a solid body comprising; a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.

Abstract: A simple silicone-rubber bonded object is provided in which non-flowable substrates, i.e., a three-dimensional silicone rubber elastic substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other without using a flowable curable adhesive or pressure-sensitive adhesive and which is inexpensive and has high productivity. The silicone-rubber bonded object comprises a three-dimensional silicone rubber elastic substrate having hydroxyl groups on the surface and an adherend substrate having hydroxyl groups on the surface, the substrates having been laminated to each other through covalent bonding between the hydroxyl groups of both. The elastic substrate and/or the adherend substrate has undergone corona discharge treatment and/or plasma treatment, whereby the hydroxyl groups have been formed on the surface thereof.

Abstract: Provided is a small, simple-structured, homogeneous and mass-producible excessive pressure release valve which works even at a relatively low excessive pressure to surely and safely release the pressure to the external world. The excessive pressure release valve has an elastic rubber plate and a reversibly openable slit that passes through the upper and the lower surfaces and release the pressure to the external world when the internal excessive pressure stressing on the lower side surface, pushes and opens the slit toward upper surface side. The elastic rubber plate is made of silicone rubber containing 1-20% by mass of silicone oil.

Abstract: A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens is used.