Patents Assigned to Asahi Tec Corportion
  • Semi-molten metal molding apparatus
    Patent number: 5638889
    Abstract: The present invention is to provide a semi-molten metal molding apparatus with a die including a die hole and a cavity, and a punch movable into the die hole, in which the die hole is opened downwardly, and the punch is set below the die hole in such a manner that it is movable into the die hole. According to the present invention, the cavity is filled with a part of the material which has no oxide film or has an oxide film smaller in thickness.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: June 17, 1997
    Assignee: Asahi Tec Corportion
    Inventors: Yasuo Sugiura, Hiroshi Seo, Seiji Saikawa