Patents Assigned to Asano Laboratories Co., Ltd.
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Patent number: 11691329Abstract: A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.Type: GrantFiled: November 23, 2021Date of Patent: July 4, 2023Assignee: ASANO LABORATORIES CO., LTD.Inventors: Kazunori Teramoto, Shogo Takai, Yusuke Suzuki, Kimihiro Iimura
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Publication number: 20230173738Abstract: A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.Type: ApplicationFiled: November 23, 2021Publication date: June 8, 2023Applicant: ASANO LABORATORIES CO., LTD.Inventors: Kazunori TERAMOTO, Shogo TAKAI, Yusuke SUZUKI, Kimihiro IIMURA
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Patent number: 11173648Abstract: A thermoforming device includes: an upper hot plate including a first heating surface configured to heat a sheet from above; a lower hot plate including a second heating surface configured to heat the sheet from below; and a substrate-supplying unit including a base configured to hold a molded substrate, and configured to attach the molded substrate to and detach the molded substrate from the base and to dispose the molded substrate at a molding position below the first heating surface with the sheet interposed therebetween, in which the upper hot plate and the lower hot plate are configured to heat the sheet simultaneously from an upper surface and a lower surface of the sheet, the lower hot plate is provided to be movable in a horizontal direction with respect to a position below the upper hot plate, and the thermoforming device die-molds or adheres, onto the molded substrate held by the base, the sheet softened by being heated by the upper hot plate and the lower hot plate.Type: GrantFiled: October 17, 2016Date of Patent: November 16, 2021Assignee: Asano Laboratories Co., Ltd.Inventors: Kazunori Teramoto, Masanobu Nihira, Hideki Usami
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Patent number: 9511541Abstract: A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.Type: GrantFiled: July 2, 2013Date of Patent: December 6, 2016Assignee: Asano Laboratories Co., Ltd.Inventors: Kenichi Mizoguchi, Kazunori Teramoto
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Patent number: 9505170Abstract: A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.Type: GrantFiled: November 22, 2011Date of Patent: November 29, 2016Assignee: Asano Laboratories Co., Ltd.Inventors: Kenichi Mizoguchi, Kazunori Teramoto
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Patent number: 9364992Abstract: A thermoforming device using a hot plate heating includes a frame; a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.Type: GrantFiled: June 25, 2010Date of Patent: June 14, 2016Assignee: Asano Laboratories Co., Ltd.Inventors: Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Kazunori Teramoto
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Publication number: 20130174970Abstract: A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.Type: ApplicationFiled: November 22, 2011Publication date: July 11, 2013Applicant: ASANO LABORATORIES CO., LTD.Inventors: Kenichi Mizoguchi, Kazunori Teramoto
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Publication number: 20120211928Abstract: A thermoforming device using a hot plate heating includes a frame a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.Type: ApplicationFiled: June 25, 2010Publication date: August 23, 2012Applicant: ASANO LABORATORIES CO., LTD.Inventors: Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Kazunori Teramoto
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Patent number: 7942996Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.Type: GrantFiled: August 14, 2009Date of Patent: May 17, 2011Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
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Patent number: 7833379Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure 10 includes the steps of: compressing and deforming the multilayer structure, while extending respective layers 11, 12, 13 of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter 15, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion 14, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer 11 and surface resin layers 12, 13 of the multilayer structure to the abutting portion A of the push cutter 15 and the cutter receiving portion 14.Type: GrantFiled: July 25, 2003Date of Patent: November 16, 2010Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
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Publication number: 20090304960Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.Type: ApplicationFiled: August 14, 2009Publication date: December 10, 2009Applicants: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
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Patent number: 7539401Abstract: A heating unit includes a plurality of radiant heaters, a plurality of brackets on which the radiant heaters are mounted in a row, and a frame on which the brackets are mounted in a parallel arrangement and thereby the radiant heaters are mounted in a grid configuration, wherein each of the radiant heaters includes: a support plate substantially having a rectangular shape; a pair of connection terminals substantially perpendicularly extending, while having a space therebetween, from one surface of the support plate; and a strip-shaped heater element arranged between the pair of connection terminals and covering the one surface of the support plate, and wherein the connection terminals have connection portions projecting from the other surface of the support plated, and each of the brackets has a terminal hole into which the connection portion is inserted.Type: GrantFiled: November 10, 2006Date of Patent: May 26, 2009Assignee: Asano Laboratories Co., Ltd.Inventors: Toshihiro Takai, Yasuyoshi Ohashi, Kazushi Hayashi
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Patent number: 7495194Abstract: A heating apparatus includes a plurality of heating means that heat a heated object, a temperature measuring means that measures temperatures of some of the plurality of heating means, a heated object information storing means that stores, in a coordinate manner, heated object identification names, target heating temperatures at the heating means, and sets of heating ratios respectively assigned to the heating means, a heating information storage means that defines a relationship between temperatures during heating of the heating means up to the target heating temperatures and heating intensities at the temperatures, a heated object identification name obtaining means that obtains one of the heated object identification names, a heated object information reading-out means that reads out one of the target heating temperatures and one of the sets of heating ratios respectively assigned to the plurality of heating means, corresponding to the heated object identification name from the heated object information stType: GrantFiled: November 10, 2006Date of Patent: February 24, 2009Assignee: Asano Laboratories Co., Ltd.Inventors: Toshihiro Takai, Yasuyoshi Ohashi, Kazushi Hayashi
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Patent number: 7323664Abstract: A heating system includes a plurality of radiant heaters, a power source supplying electricity to the radiant heaters, and a transformer provided between the radiant heaters and the power source, wherein each of the radiant heaters includes a support plate substantially having a rectangular shape, a pair of connection terminals substantially perpendicularly extending, while having a space therebetween, from one surface of the support plate, and a strip-shaped heater element arranged between the pair of connection terminals and covering the one surface of the support plate, wherein voltage E between the pair of connection terminals is adjusted by the transformer so as to satisfy an inequality of 25 V?E?35 V, wherein a width W of the strip-shaped heater element is set so as to satisfy an inequality of 8.5 mm?W?11.7 mm, and a thickness t thereof is set so as to satisfy an inequality of 0.05 mm?t?0.Type: GrantFiled: November 10, 2006Date of Patent: January 29, 2008Assignee: Asano Laboratories Co., Ltd.Inventors: Toshihiro Takai, Yasuyoshi Ohashi, Kazushi Hayashi