Patents Assigned to Asia Pacific Microsystems
  • Three-dimensional integrated adjustable inductor, its module and fabrication method of the same
    Patent number: 6859129
    Abstract: A three dimensional adjustable high frequency inductor, its module and fabrication method of the same. The high frequency module includes micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: February 22, 2005
    Assignee: Asia Pacific Microsystems
    Inventors: Shu-Hui Tsai, Shang-Yu Liang, Chun-Hsien Lee