Patents Assigned to Asia Vital Components Co., Ltd.
  • Patent number: 11962225
    Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 16, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-Cheng Tang., Hao-Yu Chen, Hsu-Jung Lin
  • Patent number: 11933311
    Abstract: A fan brake structure includes a fan and a brake device. The fan has a frame body, a fan impeller and a stator. The brake device is disposed under a bottom of a bearing cup. The brake device has a driving member, a brake member and an elastic member. The elastic member abuts against one end of the brake member. The other end of the brake member has a boss body. The driving member has a spiral rail. When the driving member rotates, the boss body moves along the spiral rail, whereby the brake member linearly reciprocally moves upward to brake the fan impeller or linearly reciprocally moves downward to release the fan impeller from the braking.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: March 19, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chih-Cheng Tang, Hao-Yu Chen, Hsu-Jung Lin
  • Patent number: 11936278
    Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against the brake plate and the electromagnet. When the fan is powered off, the electromagnet is energized and produces magnetic poles that magnetically repel the magnetic member, such that the brake pin is pushed by a magnetic force and the elastic element toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: March 19, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-Cheng Tang, Hao-Yu Chen, Hsu-Jung Lin
  • Patent number: 11917795
    Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: February 27, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yuan-Yi Lin, Fu-Kuei Chang
  • Patent number: 11905964
    Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 20, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Chu-Hsien Chou, Yi-Chih Lin, Pei-Chuan Lee, Wen-Hao Liu
  • Patent number: 11910574
    Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber. A first wick structure layer and a holding-down member are provided between the first and the second plate member and received in the airtight chamber. The holding-down member is located above the first wick structure layer, such that the first wick structure layer is held down by the holding-down member to be closely and flatly attached to the second plate member without warping.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: February 20, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuo-Chun Hsieh, Wei-Te Wu
  • Patent number: 11892252
    Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: February 6, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Ming-Tsung Yang, Kuan-Lin Huang, Sung-Wei Lee
  • Patent number: 11832380
    Abstract: A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: November 28, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11817372
    Abstract: A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: November 14, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Sheng-Huang Lin
  • Publication number: 20230353004
    Abstract: A fan structure includes a fan frame having a base and a shaft barren vertically upward extended from the base; a motor stator enclosure having a top provided with a shaft hole and an open bottom correspondingly covering and connecting to a top of the base, such that the motor stator enclosure, the shaft barrel and the base together define a potting space among them; a potting opening selectively provided on the base or the motor stator enclosure to communicate with the potting space; a motor stator externally fitted around the shaft barrel and located in the potting space; and a potting compound filled in the potting space to cover the motor stator. With the above arrangements, the fan structure overcomes the problem in conventional inconvenient fan potting process to largely reduce production costs, production time, bad yield rate, and reworking.
    Type: Application
    Filed: November 24, 2022
    Publication date: November 2, 2023
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jing-Ping Huang, Feng Liu
  • Publication number: 20230349394
    Abstract: A fan frame with noise muffling structure includes a frame having a top and a bottom and defining a centered air flow passage that extends from the top to the bottom. The air flow passage has an air inlet and an air outlet formed on the top and the bottom, respectively. The frame further has a noise muffling zone in at least one area of the frame located between the air flow passage and an outer periphery of the frame. In the noise muffling zone, there is provided at least one noise muffling unit, which is located between the top and the bottom without communicating with the air flow passage. The noise muffling unit internally defines a hollow cavity, which is closed between but not extended through the top and the bottom. The hollow cavity isolates air flow noise and absorbs frame vibration and noise produced by the frame vibration.
    Type: Application
    Filed: November 24, 2022
    Publication date: November 2, 2023
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hua Lai, Ze-Hua Tan
  • Patent number: 11799221
    Abstract: A fan connector structure is applicable to a system circuit board having a circuit board-end connector provided thereon and includes a fan having a fan frame main body and a fan-end connector projected from an outer side of the fan frame main body. The fan-end connector and the fan frame main body can be selectively integrally or non-integrally formed with each other. The fan-end connector is correspondingly connectable to the circuit board-end connector, so as to realize the purpose of automated and quick assembling of the fan to the system circuit board with less labor and time cost.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: October 24, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11788544
    Abstract: A centrifugal-to-axial mixed flow blower includes a blower enclosure defining a blower chamber and a centrifugal impeller supported on an impeller seat to suspend in the blower chamber. The centrifugal impeller includes a plurality of blades and a radially outward declined flow passage defined between any two adjacent blades and communicable with the blower chamber. The blower chamber is communicable with a rectangular air outlet of a heat dissipation system via a frame passage of a flow guide frame connected to below the blower enclosure. Air stream centrifugally drawn in by the centrifugal impeller passes through the declined flow passages to radially outward and downward flow into the blower chamber and then passes through the frame passage to flow axially through the rectangular air outlet into the heat dissipation system, so as to realize the effects of reduced noise, changing centrifugal vortical flow into axial flow, and decreased flow loss.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: October 17, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Jing-Ping Huang, Zizhuo Li, Feng Liu
  • Publication number: 20230327381
    Abstract: A fan electrical connection structure includes a fan having a fan frame, which has a circuit board and an electrical connection section provided therein. The electrical connection section includes a plurality of metal terminals and is extended in a direction parallel to an air flow passage defined in the fan frame. The metal terminals respectively have an end electrically connected to the circuit board and another end extended into the electrical connection section. With the above arrangements, parts for electrical connection in the fan are simplified and can be easily connected or disconnected by a user with only one hand.
    Type: Application
    Filed: November 24, 2022
    Publication date: October 12, 2023
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Feng Liu, Zizhuo Li
  • Patent number: 11761710
    Abstract: A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: September 19, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Kuo-Chun Hsieh
  • Patent number: 11765861
    Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.
    Type: Grant
    Filed: May 5, 2019
    Date of Patent: September 19, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Hsiu-Wei Yang
  • Patent number: 11732974
    Abstract: A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: August 22, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Kuo-Chun Hsieh
  • Patent number: 11737236
    Abstract: A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: August 22, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuan-Lin Huang, Jun-Chun Chiu
  • Patent number: 11719491
    Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.
    Type: Grant
    Filed: June 5, 2022
    Date of Patent: August 8, 2023
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Patent number: D1009813
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: January 2, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan