Abstract: A triggering control device for enabling a data collection host assembled on it to execute a corresponding function action comprises a Bluetooth communication module, a control module, a power supply module and a housing containing the foregoing components. The Bluetooth communication module for communicating the triggering control device is controlled by the control module to drive the Bluetooth communication module to output a triggering signal, and the data collection host is enabled while receiving the triggering signal. Thereby, the triggering control device enables the data collection host to proceed a functional action by the Bluetooth communication module, so as to solve the contact fault or interference problem of the prior art.

Abstract: A voice triggering control device for enabling a data collection host which assembled on it comprises a processing unit, a speaker, a control module, a power supply module and a housing containing the elements disclosed above. The control device controls the processing unit to output a high-frequency audio signal which is corresponded to an act command Then, broadcasting a high-frequency audio through the speaker, wherein the high-frequency audio is generated by the high-frequency audio signal, and the data collection host is enabled to perform the act command while receiving and decoding the high-frequency audio. Thereby, making the triggering control device enabling the data collection host proceed a functional action by the high-frequency audio can solve the contact fault problem in the prior art.

Abstract: A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.

Abstract: A liquid crystal module comprises at least a liquid crystal panel with a display side and a liquid crystal side corresponding to each other, wherein at least one portion of the liquid crystal side is a heating portion, such that the heating portion can be driven to heat the liquid crystal side when the temperature of the environmental is under a liquid crystal working temperature. In addition, a liquid crystal anti-freeze method for the liquid crystal module is disclosed.

Abstract: A framework of wireless network access device, comprising a communication circuit board with a first electrical connecting portion, a wireless transmission circuit board with a second electrical connecting portion, and at least a signal transmission element connecting with the first and second connecting portions respectively, wherein the signal transmission element is provided for transmitting a signal between the communication circuit board and the wireless transmission circuit board, so as to solve drawbacks of the prior art.

Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide formed between the reference planes and the conducting wires, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.

Abstract: The present invention provides an emitting device that is applied to a communication product having a casing and a plurality of embedding portions installed at the casing. The emitting device comprises a plurality of emitting portions corresponding to the embedding portions respectively and a plurality of connecting portions, and each connecting portion is coupled between two adjacent emitting portions, and each emitting portion is embedded into each embedding portion and partially exposed from the casing, such that the integrated emitting device can reduce the level of complexity of the conventional assembling process.

Abstract: An assembly device applicable to assembling an isolation cover to a main body of a circuit board is provided. The main body and the isolation cover respectively have a plurality of first positioning portions and a plurality of second positioning portions corresponding to each other. The second positioning portions correspondingly pass through the first positioning portions, respectively. The assembly device includes a base, a press-fitting mechanism movably connected to the base, and a drive mechanism disposed at the base. The base has a supporting portion for disposing the isolation cover and the main body. The press-fitting mechanism has a press-fitting portion facing the supporting portion. The drive mechanism has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion of the base via the drive portion, so as to bend and fasten ends of the second positioning portions.

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

Abstract: A fixing device includes a housing, a bezel, and a rib structure. The housing has a first side. The bezel is connected to the housing for covering the flat structure with the housing. The bezel has a second side and a third side. The rib structure is disposed outside the flat structure and is located between the first side of the housing and the second side of the bezel for keeping a gap between the second side of the bezel and the flat structure.

Abstract: A error detection/correction system includes a plurality of cable modems for error detection/correction, a CMTS connected with the cable modems for access of MAC addresses of the cable modems and for controlling allocation of data flow of the cable modems, and a sample comparison system having a database of comparable data and connected with the CMTS for access of the data flow of the cable modems and then for comparison between the data flow and the comparable data to verify whether each of the cable modems functions well or not.

Abstract: A communication apparatus includes a housing and an electronic device installed in the housing. The housing has a shell body having a top wall, a front wall and a mounting zone defined by a part of the top wall and a part of the front wall, and a cover coupled to the mounting zone. The mounting zone is provided with a first row of through holes and a second row of through holes. The cover has a row of light-guiding rods at a back side thereof, which are respectively selectively insertable into the first or second row of through holes. The electronic device includes a circuit board and a plurality of lamps electrically connected to and controlled by the circuit board.

Abstract: An EMI-resistant circuit board assembly includes a plurality of circuit boards arranged in a stack and a metal shielding frame respectively sandwiched in between each two adjacent circuit boards. One of the circuit boards has at least one high-speed device producing high-frequency noises to the ambient, which result in EMI effect. The metal shielding frame is electrically connected to the ground potential of the circuit boards and shields the high-speed device on the circuit board to guide the high-frequency noises to the ground potential.

Abstract: A downstream power calibration method comprises the following procedures. First, select base sampling frequencies and sampling power levels, thereby generating base sampling signals. Next, input base sampling signals into a modem such that obtaining each sum of the feedback signals responding to the tuner and the IF amplifier of the modem by the modem chip corresponding each said base sampling signal, thereby setting up a sampling data table. Third, repeat the procedure mention above for a plurality of modems to get a plurality of sampling data tables respectively, and then obtain a mean data table. Fourth, select spot frequencies and spot power levels from the base sampling frequencies and the base sampling power levels to generate spot sampling signals. Thereafter, input the spot sampling signals into a cable modem and set up a skeleton data table.