Abstract: A method of removing deposits from selected areas of a substrate-processing chamber comprising applying RF energy to a coil located around selected areas of the chamber is provided. Also provided is a substrate-processing chamber with improved cleaning properties having a coil capable of being coupled with an RF field disposed at selected areas of the chamber.

Abstract: An apparatus for processing substrates comprising a process chamber having walls, wherein one or more selected regions of the walls are different temperatures than other regions of said walls during processing of substrates, whereby the chamber has reduced deposition of byproducts from processing is provided. Methods of minimizing deposition on a reaction chamber having walls comprising altering the temperature of selected regions of the walls are also provided.

Abstract: A substrate processing system includes a substrate handling chamber and an integrated load lock chamber. The load lock chamber has a gated inlet for the transfer of a substrate into and out of the load lock chamber and a gated port for transferring a substrate between the load lock chamber and the substrate handling chamber. The substrate handling chamber includes a staging shelf that is positioned above the load lock chamber and a substrate handler for moving a substrate between the load lock chamber and the staging shelf. In use, a first substrate is placed at a load lock station that is located inside the load lock chamber. The first substrate is moved from the load lock station to a staging shelf located inside the substrate handling chamber. A second substrate is moved from a cooling station in the substrate handling chamber to the load lock station. A third substrate is moved from a substrate processing chamber to the cooling station.

Abstract: A method of removing deposits from selected areas of a substrate-processing chamber comprising applying RF energy to a coil located around selected areas of the chamber is provided. Also provided is a substrate-processing chamber with improved cleaning properties having a coil capable of being coupled with an RF field disposed at selected areas of the chamber.