Abstract: A wire bonding machine having a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
January 11, 1999
Date of Patent:
August 29, 2000
ASM Assembly Automotion Ltd.
Chi Wah Cheng, Ka On Yue, Chiu Fai Wong