Abstract: A stamped leadframe for a leadless package and a method of manufacturing the same are provided wherein the leadframe has at least a die pad, a frame, tie bars connecting the die pad to the frame and a plurality of leads. Each lead comprises a first portion and a second portion, and the second portion is connected substantially parallel to and displaced relative to the first portion by a distance that is less than the thickness of the first portion. Portions of the tie-bars and/or die pad may be similarly displaced.

Abstract: A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.

Abstract: A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.

Abstract: A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.