Abstract: A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.
Abstract: A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2).
Type:
Grant
Filed:
November 4, 2015
Date of Patent:
November 28, 2017
Assignee:
ASM ASSEMBLY SYSTEMS GMBH & CO. KG
Inventors:
Franz Heuberger, Rudolf Kiener, Christian Meissner
Abstract: A belt conveyor (10) for an automatic placement machine (50) that includes at least a rotatably mounted pinwheel (12) for conveying a belt (11), a drive (14) with at least one gear wheel (16) for driving the pinwheel (12) and a position-determining device (20) for determining a rotational position of the pinwheel (12), the position-determining device (20) having a first sensor device (30) with at least one magnetoresistive sensor arrangement (31). The disclosure further includes an automatic placement machine (50) having at least one belt conveyor (10).
Abstract: A device and appertaining method for picking up devices in a component placement device permits even very small components and even a first component of a new belt to be picked up by scanning the structural features of the belt directly in the proximity of the components. The positional tolerances can be disregarded so that even the first component of a new belt can be reliably detected by the pick-up tool.
Type:
Grant
Filed:
December 30, 2005
Date of Patent:
February 26, 2013
Assignee:
ASM Assembly Systems GmbH & Co. KG
Inventors:
Thomas Bachthaler, Hans-Horst Grasmueller, Thomas Liebeke, Michael Schwiefert
Abstract: Version management for manufacturing system software involves a two-part data structure, having two identifiers that are separately and automatically modified, depending upon the changes or modifications that are made, respectively, to top-level and lower-level subsets of manufacturing system programs. According to various other aspects of the present invention, methods for managing revisions involve automatically assigning a version designator under preselected conditions, automatically notifying personnel having a need to know of the change, and managing revisions by way of a revision compare function.
Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.
Type:
Grant
Filed:
January 5, 2006
Date of Patent:
March 29, 2011
Assignee:
ASM Assembly Systems GmbH & Co. KG
Inventors:
Matthias Frindt, Mohammad Mehdianpour, Harald Stanzl