Abstract: Improved leadframe and method for the insert molding of semiconductor components or the like. A plurality of leads separated by zero-flash tab means for controlling the flash during molding are formed in a single sheet of material. The zero-flash tab means are stamped from the stock sheet and then reinserted into the area between adjacent leads. The zero-flash tab means desirably comprise a ridge section for strength and facilitating removal after the molding operation.
Type:
Grant
Filed:
March 20, 1987
Date of Patent:
October 18, 1988
Assignee:
ASM Fico
Inventors:
Mike Olla, Harold Trammell, Linn Garrison