Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.

Abstract: A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.

Abstract: A method and a component placement device are provided for adjusting at least one optional setting of a process characteristic of the component placement device, which component placement device has at least one standard setting. The optional setting may be activated by way of an electronic key supplied to the component placement device. The optional setting may be temporarily activated by feeding the electronic key to the component placement device. Further, the standard setting may be reactivated after the expiration of a predetermined period of operation of the electronic key.

Abstract: Component placement apparatus (1, 21) comprising a storage device (2) for storing components, means (5, 25, 71, 81, 91) for transporting a component from the storage device (2) to a transfer device (6, 26) comprising at least one component pickup position (11), and a component pick and place device (7) for picking up a component from the pickup position and placing the component on a desired location on a substrate (8) positioned on a substrate support. The transfer device (6, 26) is movable between a position relatively close to the stationary storage device (2) and a variable desired position above the substrate support relatively close to the movable pick and place device whilst the means (5, 25, 71, 81, 91) for transporting a component from the storing device to the transfer device (6, 26) comprise guiding means for guiding a tape (4) comprising components from reel (3) located in the storage device (2) into the component pickup position (11) on the transfer device (6, 26).

Abstract: A component placement unit for placing a component on a substrate, which component placement unit comprises at least one nozzle which is rotatable about a central axis, by means of which a component can be picked up and placed on the substrate. The component placement unit further comprises at least one sensor for determining the orientation of the component relative to the nozzle. At least one optical element is disposed between said sensor and said nozzle. A first focus plane of the optical element at least substantially coincides with the central axis of the nozzle, whilst a second focus plane substantially coincides with the sensor, wherein an image produced by means of the sensor is a contour image of the component.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Abstract: A displacement device is provided with a linear motor which comprises a first part comprising magnetic strips and a second part comprising a coil block. The parts are connected via a linear guide. The second part is movable with respect to the first part in a conveying direction extending parallel to the guide. The displacement device further comprises an connected to said second part, which is located on a side of the first part remote from the second part. The displacement device can be used is a component placement device.

Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: A component placement machine includes: a transport device for transporting PCBs in an X-direction; first and a second feeder areas; at least one Y-slide beam that is drivable in the X-direction; and at least two placement heads on each Y-slide beam, which placement heads are independently drivable in the Y-direction and dependently drivable in the X-direction. Each feeder area includes at least one feeder for storing components. Such a machine enables a number of actions to be performed simultaneously. For example, within a certain period of time, a plurality of placement heads can simultaneously pick up components from a feeder, while other placement heads, which previously picked up components, may be moved to desired X-Y positions of the PCB which the previously picked up components may be placed, thereby resulting in an improved output.

Abstract: A device comprises an imaging device, a placement element connected to the imaging device for placing a component on a substrate, as well as an optical system having an optical axis. The placement element and the imaging device can be jointly moved relative to the optical system to at least a position in which the optical axis is located between the imaging device and the placement element, wherein the position of a component supported by the placement element can be detected by means of the imaging device. The optical system is telecentric at least in an image space located near the imaging device as well as in an object space located near the placement element.

Abstract: In an for controlling a feeder or feeder cart used in a pick-and-place electronics assembly machine, non-physical contact transmitters and receivers transfer data, such as feeder trigger signals, feeder ready signals, and component identification and usage information, between the feeder and/or feeder cart and the pick-and-place machine. Wiring or other physical connections between feeder, feeder cart, and pick-and-place machine controls are not required. A common, universal interface between different types of feeders, feeder carts, and pick-and-place machines is possible.

Abstract: By means of a method, at least one component is placed on at least one substrate. The component is picked-up by at least one placement machine and is placed at a desired position on the substrate. After the component is placed on the substrate, an image of the component placed on the substrate is taken by a camera. Any difference between the actual position of the component on the substrate and a desired position of the component on the substrate is established on account of the image. The positioning of another component to be placed on the substrate takes into account any such difference.

Abstract: A method and a device are provided for estimating at least one component placement position on a substrate at which a component is to be placed. The component placement position is estimated on the basis of the position of at least one mark on the substrate. The statistical measurement inaccuracies of the marks are determined. Subsequently, the positional accuracy of the component placement position on the substrate is estimated on the basis of the measurement inaccuracies of the marks. Subsequently, the estimated positional accuracy of the component placement position is compared with a desired positional accuracy. Subsequently, a determination is made regarding whether the component is to be placed on the substrate with the estimated positional accuracy of the component placement position.

Abstract: Component placement apparatus (1, 31) comprising a storage device (2, 32) for storing components, means (3, 33) for transporting a component from the storage device (2, 32) to a transfer device (4, 5, 37) comprising at least one component pickup position, and a component pick and place device (6, 36) for picking up a component from the pickup position and placing the component on a desired location on a substrate (7) positioned on a substrate support. The transfer device (4, 5, 37) is movable between a position relatively close to the stationary storage device (2, 32) and a variable desired position above the substrate support relatively close to the movable pick and place device.

Abstract: Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In addition, a total distance to be covered by the component placement unit is calculated for the number of components to be placed, wherein the number of components to be placed is determined beforehand. This total distance value is subsequently compared with a reference value. If the total distance value is greater than the reference value, the substrate to be provided with the components is rotated with respect to the component pickup position about an axis that extends perpendicularly to the substrate.

Abstract: According to a method and a device for heating a strip-shaped carrier in an oven, a carrier is passed through the oven in a direction of conveyance. The carrier is supported by a heatable plate, which together with the carrier is moved through the oven stepwise with a predetermined step size from a starting position to an end position.

Abstract: A method is provided for supplying a component to a pick-up position located near a stop by means of a component supplying device. The component supplying device includes a guide provided with the stop, at least one air inlet connected to the guide, and at least one air outlet also connected to the guide. Components are carried through the guide in a transport direction towards the stop by means of air supplied through the air inlet. Once a number of components have been transported in the transport direction, the air outlet is substantially closed by at least one component present in the row. Subsequently, at least one component following the row is transported in a non-transport direction.

Abstract: A component placement device includes at least two component pick and place units, which are connected to a movable frame, and at least two component feeding devices. The component placement device is suitable for simultaneously picking-up components supplied, by means of the component feeding devices, by means of the component pick and place units. At least one component pick and place unit can be moved relative to the frame, which permits adjustment of the positions of the component pick and place units relative to one another.