Abstract: A method of operating a die attach system is provided. The method includes the step of providing a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The method also includes the step of imaging each of the plurality of die with respective ones of the plurality of substrate reference markers using an imaging system of the die attach system for determining an alignment of the plurality of die with the verification substrate.

Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

Abstract: A method for driving a component placement device, the component placement device having a machine frame, component pickup units and a subframe, the first and second component pickup units configured to be movable in a direction of travel, the method comprising: moving at least one of the component pickup unit in the direction of movement relative to the subframe, the component pickup units and the subframe configured for a reactive force to be exerted on the subframe by the moving of the at least one of the component pickup units; determining a counterforce to be exerted against the subframe substantially opposite a direction of the reactive force, the counterforce determined by an auxiliary control unit, wherein the counterforce at least partially counteracts the reactive force; and applying the counterforce to the subframe substantially in the opposite direction of the reactive force by at least one drive unit.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: A moving device comprises at least a first element provided with main magnets and a second element provided with coils. The main magnets are arranged in a grid of rows and columns, wherein main magnets in adjacent rows are oppositely polarised and staggered relative to each other. The coils can be energized for moving the first element relative to the second element in a direction parallel to the rows as well as in a direction parallel to the columns. Auxiliary magnets of the same polarity are disposed between the main magnets at least in a number of rows, wherein the strength of the magnetic field of said auxiliary magnets is different from that of the main magnets.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A component placement device comprises a machine frame and at least two component pickup units which are movable relative to at least one subframe supported by a machine frame. Each component pickup unit is movable at least in a direction of movement. The component placement device comprises means for determining the magnitude of a counterforce to be exerted on the subframe substantially in the direction of movement, as well as at least one drive unit for exerting the counterforce determined by said means substantially in the direction of movement on the subframe for the purpose of at least partially counteracting the reactive force exerted on the subframe by at least one component pickup unit during movement of the component pickup unit in the direction of movement relative to the subframe.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A moving device comprises at least a first element which is movable in a direction of movement by means of a drive unit, which first element at least comprises at least one first magnetic part. The moving device further comprises a second element, with respect to which the first element is movable at least from at least one operative position spaced from the second element to a rest position near the second element. The second element comprises at least one second magnetic part, which is polarized in a polarization direction opposed to the polarization direction of the first magnetic part. The polarization directions extend transversely to the direction of movement and also transversely to surfaces of the first and second elements that are positioned opposite each other in the rest position.

Abstract: A method of establishing at least one marking element on a substrate (1). By means of design data of the substrate (1) at least a fictitious marking element (5) on the substrate (1) is determined. The fictitious marking element (5) should then be unique for a predefined area of the substrate (1). The fictitious marking element is obtained by selecting at least two transitions (6, 7, 17, 18) of at least one element on the substrate while the transitions (6, 7, 17, 18) enclose an angle to each other.