Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.

Abstract: A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Abstract: A component placement device is provided. The component placement device includes a machine frame, a subframe supported by the machine frame, and a component pickup unit. The component pickup unit is movable relative to the subframe. The component pickup unit is movable by a first drive at least in a direction of movement. The component placement device includes a movable counter-mass being movable relative to the subframe by a second drive in a direction opposite to the direction of movement of the component pickup unit to at least partially counteract a reactive force exerted on the subframe by the component pickup unit during movement of the component pickup unit in the direction of movement relative to the subframe.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

Abstract: A method for driving a component placement device, the component placement device having a machine frame, component pickup units and a subframe, the first and second component pickup units configured to be movable in a direction of travel, the method comprising: moving at least one of the component pickup unit in the direction of movement relative to the subframe, the component pickup units and the subframe configured for a reactive force to be exerted on the subframe by the moving of the at least one of the component pickup units; determining a counterforce to be exerted against the subframe substantially opposite a direction of the reactive force, the counterforce determined by an auxiliary control unit, wherein the counterforce at least partially counteracts the reactive force; and applying the counterforce to the subframe substantially in the opposite direction of the reactive force by at least one drive unit.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: A moving device comprises at least a first element provided with main magnets and a second element provided with coils. The main magnets are arranged in a grid of rows and columns, wherein main magnets in adjacent rows are oppositely polarised and staggered relative to each other. The coils can be energized for moving the first element relative to the second element in a direction parallel to the rows as well as in a direction parallel to the columns. Auxiliary magnets of the same polarity are disposed between the main magnets at least in a number of rows, wherein the strength of the magnetic field of said auxiliary magnets is different from that of the main magnets.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A component placement device comprises a machine frame and at least two component pickup units which are movable relative to at least one subframe supported by a machine frame. Each component pickup unit is movable at least in a direction of movement. The component placement device comprises means for determining the magnitude of a counterforce to be exerted on the subframe substantially in the direction of movement, as well as at least one drive unit for exerting the counterforce determined by said means substantially in the direction of movement on the subframe for the purpose of at least partially counteracting the reactive force exerted on the subframe by at least one component pickup unit during movement of the component pickup unit in the direction of movement relative to the subframe.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system.