Patents Assigned to Assembly Technologies Int., Inc.
  • Soldering assembly
    Patent number: 6335514
    Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: January 1, 2002
    Assignee: Assembly Technologies Int., Inc.
    Inventors: Matthew J. McAmmond, Joseph H. Mickle