Abstract: A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may closed about the wafer while the closable enclosure is surrounded by the process gas.
Type:
Grant
Filed:
April 12, 1996
Date of Patent:
November 17, 1998
Assignee:
AST Electronik
Inventors:
Guenter Kaltenbrunner, Zsolt Nenyei, Helmut Sommer