Abstract: In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies.

Abstract: In securing a semiconductor chip to a substrate of ceramic material or the like, a de-focused laser beam having a wave length to which the substrate is substantially opaque is directed over a relatively large area of the reverse side of the substrate. Heat generated at the reverse side of the substrate then flows through the substrate to heat bonding material that is placed between the engaging surfaces of the chip and substrate. In this manner direct heating of the chip is avoided or minimized, and damage to both chip and substrate is also minimized.