Abstract: A method for manufacturing a light-emitting module includes: firstly, attaching a semiconductor structure on a first supporting substrate, the semiconductor structure including a bottom layer and a plurality of light-emitting chips disposed on the bottom layer; next, separating the bottom layer from the semiconductor structure, the light-emitting chips being borne on the first supporting substrate; then, attaching the first supporting substrate with the light-emitting chips on a second supporting substrate; subsequently, separating the first supporting substrate from each light-emitting chip, each light-emitting chip having at least two lands exposed to exterior; next, separating each light-emitting chip from the second supporting substrate; and then disposing each light-emitting chip on a circuit board. Therefore, the light-emitting module is finished by the above-mentioned steps.