Abstract: A skeleton wafer inspection system includes an expansion table displaceable relative to a camera configured for capturing segmental images of a skeleton wafer on a film frame. During segmental image capture, illumination is directed to the top and/or bottom of the film frame. Segmental images are digitally stitched together to produce a composite image, which can be processed to identify die presence or absence therein at active area die positions having counterpart die positions in a process wafer map. A composite image of a diced wafer on a film frame can also be generated, and used as a navigation aid or guide during die sort operations, or to verify whether a die sort apparatus has correctly detected a reference die prior to die sort operations. A composite image of a skeleton wafer can similarly be generated for use as a navigation aid or guide for film frame repopulation operations.

Abstract: A system for inspecting semiconductor devices is provided. The system includes a region system selecting a plurality of regions from a semiconductor wafer. A golden template system generates a region golden template for each region, such as to allow a die image to be compared to golden templates from a plurality of regions. A group golden template system generates a plurality of group golden templates from the region golden templates, such as to allow the die image to be compared to golden templates from a plurality of group golden templates.

Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.

Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.

Abstract: A system for inspecting components is provided. The system includes a CMOS imaging system generating image data, such as pixel data from a pixel array. An image analysis system is connected to the CMOS imaging system, the image analysis system receiving the image data and generating image analysis data. The CMOS imaging system generates the image data at a rate that allows the CMOS imaging device to be used for inspecting components.

Abstract: A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. One image is a direct backlit image of the device. A second image taken along a direction corresponding to a second optical axis is reflected into a direction corresponding to the first optical axis. By forming two images it is possible to locate the leads of the semiconductor device in three dimensions.

Abstract: A system for inspection components that are sealed within tape is provided. The system includes a light source that can illuminate the components through a tape layer. A polarizer is used to polarize light from the light source, the components, and the tape layer, so as to reduce glare and reflected light. An image system receives light from the polarizer and stores image data for each component.