Abstract: A friction member according to an embodiment is a friction material having a copper content of less than 5 wt %, the friction material including a titanic acid salt having a content of 1 wt % or more and 8 wt % or less, a cryolite powder having a content of 0.5 wt % or more and 5 wt % or less, and an iron oxide powder having a median diameter of 15 to 30 ?m (D50) and a content of 1 wt % or more and 10 wt % or less.

Abstract: Disclosed is a strip substrate including a dielectric layer that has a plurality of unit regions spaced apart from each other in a first direction and a saw line region between the unit regions, a plurality of conductive dummy patterns on corresponding unit regions of the dielectric layer, a plurality of saw line patterns on the saw line region of the dielectric layer and extending in a second direction that intersects the first direction, and a protection pattern that covers the dielectric layer. Ends of the conductive dummy patterns are spaced apart from each other in a direction parallel to the first direction. Ends of the saw line patterns are spaced apart from each other in a direction parallel to the second direction. The protection pattern is between the ends of the conductive dummy patterns and between the ends of the saw line patterns.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a communication interface, a memory configured to store executable program and a processor coupled with the memory and configured to sense a predetermined event related to a first external device for controlling the electronic apparatus, based on the sensed predetermined event, identify at least one second external device for obtaining information related to the first external device, receive information related to the first external device from the at least one second external device, identify a user input of manipulating the first external device based on the information related to the first external device, and perform a function of the electronic apparatus based on the user input.

Abstract: The present application discloses a drive chip and a display panel. The drive chip includes a first area and a second area. The drive chip includes a substrate and drive pins. The density of the pins located in the first area is lower than the density of the pins located in the second area. The pins located in the second area includes first drive pins and second drive pins. The distance between the substrate and a face of the first drive pins away from the substrate is greater than the distance between the substrate and a face of the second drive pins away from the substrate. The occurrence of poor electric conduction is avoided.

Abstract: According to an embodiment, an electronic device comprises: a housing including a through hole formed outside of the housing, and a seating part connected to the through hole, and the seating part accommodating insertion of an electronic pen through the through hole; a seating part cover surrounding at least of a part of the seating part; a cantilever disposed in the seating part, the cantilever including an elastic part extending to have a distance from the seating part cover that increases along an insertion direction of the electronic pen; wherein the cantilever includes a connection part connecting the seating part cover and the elastic part and a support part protruding from one surface of the elastic part facing the seating part cover and extending in a direction away from the connection part.

Abstract: A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.

Abstract: An electronic device includes a display layer that displays an image during a plurality of frame periods, a sensor layer, a sensor driving unit, and a main driving unit. When a user makes a call, the sensor driving unit switches from a first mode to a second mode and drives the sensor layer. When the sensor layer senses a large-area conductor in the second mode, the sensor driving unit switches from the second mode to a third mode and drives the sensor layer. When the main driving unit determines a proximity state in the third mode, the sensor driving unit switches from the third mode to the second mode and drives the sensor layer. When the sensor layer senses a touch in the second mode, the sensor driving unit switches from the second mode to a fourth mode and drives the sensor layer.

Abstract: A light emitting device includes a backplane, an array of light emitting diodes attached to a frontside of the backplane, a positive tone, imageable dielectric material layer, such as a positive photoresist layer, located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, such that sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile, and at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes.

Abstract: A display substrate, including: a base substrate, a plurality of sub-pixels each including at least a pixel electrode and a common electrode; a first interlayer insulating layer between layers where the pixel electrode and the common electrode are respectively located; and a plurality of touch signal lines extending along a second direction and arranges side by side along a first direction, where a distance between orthographic projections of the touch signal line and the pixel electrode in the sub-pixel closest to the touch signal line in the first direction on the base substrate is a first distance; a distance between orthographic projections of the touch signal line and the common electrode in the sub-pixel closest to the touch signal line in the first direction on the base substrate is a second distance, and the first distance is less than the second distance.

Abstract: A semiconductor package according to the inventive concept includes a first semiconductor chip configured to include a first semiconductor device, a first semiconductor substrate, a plurality of through electrodes penetrating the first semiconductor substrate, and a plurality of first chip connection pads arranged on an upper surface of the first semiconductor substrate; a plurality of second semiconductor chips sequentially stacked on an upper surface of the first semiconductor chip and configured to each include a second semiconductor substrate, a second semiconductor device controlled by the first semiconductor chip, and a plurality of second chip connection pads arranged on an upper surface of the second semiconductor substrate; a plurality of bonding wires configured to connect the plurality of first chip connection pads to the plurality of second chip connection pads; and a plurality of external connection terminals arranged on a lower surface of the first semiconductor chip.

Abstract: Display panel and display device are provided. The display panel includes a base substrate; a display function layer, on a side of the base substrate, the display function layer including a plurality of subpixels arranged in an array along a first direction and a second direction, and the first direction intersects the second direction; and touch electrodes, on a side of the display function layer away from the base substrate, the touch electrodes including a plurality of touch wires intersecting to form a grid with a plurality of hollow parts, a vertical projection of a subpixel of the plurality of subpixels on a plane where the base substrate is located within a vertical projection of a hollow part of the plurality of hollow parts on the plane where the base substrate is located.

Abstract: An integrated circuit device includes a memory including a memory cell insulation surrounding a memory stack and a memory cell interconnection unit, a peripheral circuit including a peripheral circuit region formed on a peripheral circuit board, and a peripheral circuit interconnection between the peripheral circuit region and the memory structure, a plurality of conductive bonding structures on a boundary between the memory cell interconnection and the peripheral circuit interconnection in a first region, the first region overlapping the memory stack in a vertical direction, and a through electrode penetrating one of the memory cell insulation and the peripheral circuit board and extended to a lower conductive pattern included in the peripheral circuit interconnection in a second region, the second region overlapping the memory cell insulation in the vertical direction.

Abstract: An electronic device includes: a sensor layer on a display layer, the sensor layer including a sensing electrode, the display layer including: first pixels, second pixels spaced apart from the first pixels in a first direction, and third pixels arranged with the first pixels along a second direction, the second pixels are arranged along the second direction, and two adjacent second pixels form a first pixel group, the two second pixels are spaced apart by a first distance in the second direction, and the first pixel group is spaced apart by a second distance in the second direction from a second pixel group, the sensing electrode includes a first sensing electrode and a second sensing electrode each including sensing patterns each sensing pattern including a first portion adjacent to the first and third pixels, and a second portion extending in the first direction between the first and second pixel group.

Abstract: A method of making a semiconductor device, includes: providing a first dielectric layer; sequentially forming a first metal layer, a dummy capacitor dielectric layer, and a second metal layer over the first dielectric layer; and using a single mask layer with two patterns to simultaneously recess two portions of the second metal layer so as to define a metal thin film of a resistor and a top metal plate of a capacitor.

Abstract: A display device including an input sensor having sensing electrodes disposed in a sensing area and signal lines. Each of the signal lines is connected to a corresponding electrode of the sensing electrodes and disposed in the line area. One signal line of the signal lines includes a first portion having a constant width, a second portion disposed outside a corner area of the sensing area, extending from the first portion, and having a width gradually increasing in a direction that is away from the first portion, a third portion extending from the second portion and having a width gradually varying in a direction that is away from the second portion, and a fourth portion extending from the third portion and having a constant width.

Abstract: The present invention provides a nitride semiconductor device, including: a silicon substrate; a first lateral transistor over a first region of the silicon substrate and including: a first nitride semiconductor layer formed over the silicon substrate; and a first gate electrode, a first source electrode and a first drain electrode formed over the first nitride semiconductor layer; a second lateral transistor over a second region of the silicon substrate and including: a second nitride semiconductor layer formed over the silicon substrate; and a second gate electrode, a second source electrode and a second drain electrode formed over the second nitride semiconductor layer; a first separation trench formed over a third region; a source/substrate connecting via hole formed over the third region; a first interlayer insulating layer formed over the first source electrode and the second source electrode; and a second interlayer insulating layer formed in the first separation trench.

Abstract: A sensor includes a first substrate on a back side of a display panel, a first coil extending in a first direction at a predetermined angle between 0 and 90 degrees with respect to a long-side direction of the first substrate and including a first long-side portion provided with first and second end portions, a second coil including a second long-side portion extending in a second direction, a first leader line including a first end and a second end, wherein the first end is connected to the first end portion, and the second end is connected to wiring on a second substrate arranged to extend at a right angle toward the outside of the sensor from one side of the first substrate, and a second leader line including first end connected to the end portion and a second end connected to the wiring on the second substrate.

Abstract: A semiconductor device includes a substrate including a first region, and a second region, a first gate structure and a second gate structure on the substrate of the first region, a third gate structure and a fourth gate structure on the substrate of the second region, a first interlayer insulating film on the substrate of the first region and including a first lower interlayer insulating film and a first upper interlayer insulating film, a second interlayer insulating film on the substrate of the second region and including a second lower interlayer insulating film and a second upper interlayer insulating film, a first contact between the first gate structure and the second gate structure and within the first interlayer insulating film, and a second contact formed between the third gate structure and the fourth gate structure and within the second interlayer insulating film.

Abstract: A method for implementing a smart contract based on a blockchain, a device, and a medium are provided. The detailed implementation includes: creating a resident process for a resident smart contract and creating a virtual machine by the resident process when achieving an enable condition of the resident smart contract; loading codes of the resident smart contract into a memory through the virtual machine; receiving a data access request generated by a normal smart contract within a block generation cycle through an across-contract calling interface of the virtual machine; and executing the resident smart contract through the virtual machine to process the data access request and returning a data access result to the normal smart contract.

Abstract: A semiconductor device may include a substrate including first and second active regions and a field region therebetween, first and second active patterns respectively provided on the first and second active regions, first and second source/drain patterns respectively provided on the first and second active patterns, a first channel pattern between the first source/drain patterns and a second channel pattern between the second source/drain patterns, and a gate electrode extended from the first channel pattern to the second channel pattern to cross the field region. Each of the first and second channel patterns may include semiconductor patterns, which are stacked to be spaced apart from each other. A width of a lower portion of the gate electrode on the field region may decrease with decreasing distance from a top surface of the substrate.