Abstract: An example device includes a plurality of integrated circuits. Each integrated circuit includes a set of banks. Each bank includes an array of processing elements configured for single instruction, multiple data (SIMD) operations. The device further includes a set of sockets and an external interface. Each socket is configurable to connect to any bank selected from the set of banks. The external interface is connected to the set of sockets. At least two external interfaces of respective integrated circuits are connected for bidirectional communication between the respective integrated circuits. Respective sockets of the respective integrated circuits are connectable to exchange credit for data between two respective banks.