Abstract: A component carrier having: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface connected to an electrically conductive connecting element, said connecting element extending from said electrically conductive surface away from the stack and configured to be connected to at least one external component to be mounted on the component carrier when at least one connecting surface provided in/on the external component is faced to the electrically conductive surface of the component, wherein the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component. Also provided is a package using such component carrier.

Abstract: An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a central section, and at least two vertically stacked functional volume sections in the central section, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 ?m.

Abstract: A package comprising an integrated circuit substrate having an exposed substrate pad and having an exposed substrate dielectric, and an electronic component having an integrated circuit, having an exposed component pad and having an exposed component dielectric, wherein the integrated circuit substrate is connected with the electronic component so that there is a direct physical contact between the substrate pad and the component pad and so that there is a direct physical contact between the substrate dielectric and the component dielectric.

Abstract: A component carrier includes (a) a base structure having a surface with a surface profile; (b) a first dielectric layer formed on the surface of the base structure and (c) a second dielectric layer formed on the first dielectric layer. The first dielectric layer has a first main surface with a first surface profile. The first main surface faces away from the surface of the base structure. The first surface profile corresponds to the surface profile of the base structure. The second dielectric layer includes a second main surface with a second surface profile. The second main surface faces away from the surface of the base structure. The second surface profile differs from the surface profile of the base structure. A manufacturing method uses an auxiliary sheet for pressing the first dielectric layer on the main surface. The auxiliary sheet is removed before pressing the second dielectric layer.

Abstract: There is described a radio frequency module, comprising: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and ii) a RF front-end functionality that is integrated in the stack. Further, an RF arrangement, a manufacture method and a use are described.

Abstract: An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side by side, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 ?m.

Abstract: The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.

Abstract: A component carrier and a method of manufacturing a component carrier are disclosed. The component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an interposer embedded in the stack and having a plurality of vertically extending electrically conductive through connections, and electrically conductive structures in the stack laterally on both sides of the interposer.

Abstract: A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.

Abstract: A method of manufacturing a component carrier includes: (i) embedding a poorly adhesive structure in a stack, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) forming a cavity in the stack by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure; and (iii) selectively exposing a bottom of the cavity by partially removing the poorly adhesive structure. A corresponding component carrier includes analogous features.

Abstract: A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Abstract: A monitoring unit includes an integrated magnetic field sensor which includes at least one excitation coil and at least one sensor coil. Both coils are provided on one side of a first magnetic structure. The monitoring unit further includes a sensed element, which is associated with the integrated magnetic field sensor. The sensed element is suitable to alter the magnetic field of the integrated magnetic field sensor.

Abstract: A component carrier includes a first stack with an electrically insulating layer structure and an electrically conductive layer structure with a first density of trace structures and a second density of first connection structures, a second stack with a second electrically insulating layer structure and a second electrically conductive layer structure with a third density of second trace structures and a fourth density of second connection structures. A first component is applied to the first stack and a second component is embedded in the second stack. The first connection structures are respectively connected to the second connection structures. The first density of first trace structures is lower than the third density of second trace structures. The first stack and the second stack are connected with each other by the first connection structures and by the second connection structures. The first component is connected to the second component.

Abstract: A method for determining an expansion coefficient of a test material comprises: receiving first image data of a compound material, wherein the compound material comprises a plate and a layer of the test material, which is attached to the plate; receiving second image data of the compound material, which has been exposed to an environmental condition, before the second image data has been recorded; determining a measured deformation of the compound material by comparing the first image data and the second image data; and performing a simulated deformation of a model of the compound material exposed to the environmental condition and determining the expansion coefficient of the test material by varying the expansion coefficient until the simulate deformation conforms to the measured deformation.

Abstract: An electronic device includes a first component carrier having a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, a second component carrier having a second stack with at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and an intermediate structure including at least three staggered electrically conductive and coupled vertical interconnect elements in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier.

Abstract: An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

Abstract: An electronic device includes a first component carrier with a first stack having at least one first electrically conductive layer structure forming an antenna structure and at least one first electrically insulating layer structure; at least one electronic component, and a second component carrier having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure. The second component carrier further includes a heat removal structure. The first component carrier and the second component carrier are connected so that the antenna structure is positioned at one side of the electronic device for emitting and/or receiving electromagnetic radiation and the heat removal structure is positioned at an opposing other side of the electronic device.

Abstract: A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.

Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.