Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: In a method for pre-treating a frame or carrier element for use in the production of a printed circuit board, wherein after the pre-treatment the frame or carrier element is coupled with at least one circuit board element and subjected to at least one processing or treatment step, particularly at an elevated temperature, together with the circuit board element, in particular mounting or populating of the circuit board element, it is provided that the frame or support or carrier element is subjected to a heat treatment at temperatures between 120° C. and 350° C., in particular 200° C. to 300° C., for a time period (ttot) of 5 to 300 seconds, in particular 10 to 200 seconds, whereby frame or carrier elements can be provided, which are reliably stable in terms of shape and dimensions.

Abstract: A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is con

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract: In a method for processing a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards, providing at least one frame element, for coupling to a plurality of printed circuit boards, coupling or the printed circuit boards to the at least one frame element, processing the printed circuit boards in the state coupled to the frame element, it is provided that printed circuit boards of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame element to form a composite assembly and are subjected to further processing in the composite assembly formed by the printed circuit boards and the at least one frame element. Furthermore, a composite assembly for processing a plurality of printed circuit boards and also a use of such a method and composite assembly are provided.

Abstract: The invention relates to a method for producing a circuit board element having at least one electronic component, which component has a connection side defined by electrical contacts or a conductive layer and is connected to a temporary carrier for positioning and embedded in an insulating material; the component is attached in a specified position directly to a plastic film as a temporary carrier, whereupon a composite layer having at least a carrier and an electrical conductor, preferably also having an insulating material, is attached on the side of the component opposite the plastic film, with the carrier facing away from the component, and thereafter the plastic film is removed; then the component is embedded in insulating material, After the embedding of the component in the insulating material, an additional composite layer is preferably attached to the component and the embedding of the component on the side opposite the first composite layer.

Abstract: In a method for integrating at least one electronic component into a printed circuit board or a printed circuit board intermediate product, the following steps are provided: providing a layer for at least temporarily supporting the electronic component, fixing the electronic component on the layer, arranging a conductive layer on the supporting layer with at least one cutout corresponding to the dimensions of the electronic component to be fixed, at least partly encapsulating or covering the component fixed on the supporting layer with an insulating material, exposing the electronic component, and at least partial regions of the conductive layer, which adjoins the component and is arranged on the supporting layer, and at least partly making contact between the electronic component and the conductive layer adjoining the component. Furthermore, a printed circuit board and a printed circuit board intermediate product having an integrated electronic component are provided.

Abstract: In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2?) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state.

Abstract: A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1?) and application of a dielectric insulating foil (3, 3?) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4?) to the insulating layer (3, 3?); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1?) plus insulating layer (3, 3?) and conducting paths (4, 4?) by interposing a prepreg layer (5, 85; 18, 18?), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract: A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterised by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer.

Abstract: In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage.

Abstract: In the case of a multilayered printed circuit board (20), more particularly a flame-resistant and/or smoke-suppressing multilayered printed circuit board, consisting of a plurality of interconnected layers (2, 3, 12, 13) composed of incombustible, conductive material and layers (1, 11) composed of non-conductive material, two layers (2, 3, 12) composed of a conductive material in each case being separated by at least one layer (1, 11) composed of a non-conductive material, it is provided that the printed circuit board (20) contains in its interior at least two layers (2, 3, 12) having a surface proportion of at least 50%, more particularly at last 70%, composed of the incombustible, conductive material, as a result of which a multilayered printed circuit board (20) having improved flame resistance and reduced smoke evolution can be made available.

Abstract: The invention relates to a method for embedding at least one component in a printed circuit board, comprising the steps of providing a lower metal conductor foil applied to a first metal supporting layer, forming recessed alignment marks in the conductor foil, applying an adhesive layer in a registered manner in relation to the alignment marks and fitting a component via the rear face thereof on the adhesive layer with upwardly pointing connection areas, curing the adhesive layer, embedding the component in an insulting layer, applying a metal upper conductor foil and an upper metal supporting layer, consolidating the structure, removing the supporting layers, exposing the alignment marks of the lower conductor foil by removing the insulating layer, producing cutouts ending at the lower conductor foil, producing bores to the connection areas of the component in a registered manner in relation to the alignment marks, and applying a conductor layer to the upper face of the structure, producing contact connectio

Abstract: A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.

Abstract: In a method and a system for connecting a plurality of printed circuit boards (1) to at least one frame or carrier element (5), the following elements are provided: a plurality of printed circuit boards (1), which are designed to have at least one coupling element (4) on at least one edge (2, 3), at least one frame or carrier element (5) for coupling to a plurality of printed circuit boards (1) using coupling elements (6) that in each case complement at least one coupling element (4) of the printed circuit boards (1), wherein the printed circuit boards (1) can be coupled to the at least one frame or carrier element (5) by fitting the coupling elements (4, 6) of the printed circuit boards (1) and of the frame or carrier element (5), and wherein the at least one frame or carrier element (5) only surrounds or encloses the printed circuit boards (1) over a partial region of the circumference.

Abstract: In the case of a photovoltaic module which comprises a plurality of solar cells which are each coupled to an electrically conductive, structured layer for discharging the electrical energy generated in the solar cells, wherein at least two subregions of the photovoltaic module are coupled to one another via a flexible connecting region, provision is made for the solar cells to be coupled on the rear side of said solar cells to the electrically conductive, structured layer, and for the electrically conductive, structured layer to be integrated in a multilayered film arranged on the rear side of the solar cells, wherein the multilayered film forms the flexible connecting region between the at least two subregions of the photovoltaic module, as a result of which a photovoltaic module which can be tilted or folded can be made available.

Abstract: The present invention relates to a novel polymeric material with enhanced hydrophilicity for medical use comprising a biocompatible polyester material selected from the group consisting of poly(hydroxyalkanoate)s, poly(lactic acid)s, poly(glycolic acid)s, poly(caprolactone)s and copolymers and blends thereof, wherein the biocompatible polyester material is crosslinked with a functionalized poly(alkylene oxide) having at least two functional groups independently selected from the group consisting of azido-formate and alkanoyl azide. The novel polymeric material with enhanced hydrophilicity is useful as a biocompatible material in a variety of medical applications, including medical implants, bioresorbable implants, tissue engineering, and controlled release.

Abstract: The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner.

Abstract: The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component (4) comprising contacts (6) oriented towards an insulating layer (1) which is fixed to a laminate consisting of a conductive layer (2) and a insulating layer (1). Once the component (4) has been fixed to the insulating layer (1), at least one hole or perforation (8, 11) corresponding to the contacts (6) of the component (4) are formed in the conducting layer (2) and in the insulating layer (1), the contacts come into contact with the conducting layer (2), enabling a reliable integration or embedding of an electronic component (4) into a printed circuit board.