Abstract: A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.
Type:
Grant
Filed:
June 29, 2017
Date of Patent:
August 4, 2020
Assignee:
AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
Inventors:
Jonathan Silvano de Sousa, Markus Leitgeb, Walter Pessl
Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.
Type:
Application
Filed:
October 16, 2017
Publication date:
February 8, 2018
Applicant:
AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
Abstract: The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, characterized in that the heat spreader layer forms at least an outside section of a casing of said electronic device. Also an electronic device that comprises at least one component carrier according to the invention, as well as a method to produce a respective component carrier are indicated.
Type:
Application
Filed:
June 7, 2017
Publication date:
December 14, 2017
Applicant:
AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).
Type:
Application
Filed:
March 20, 2012
Publication date:
August 21, 2014
Applicant:
AT & S AUSTRIA TECHNOLOGIES & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
Type:
Grant
Filed:
May 29, 2009
Date of Patent:
July 29, 2014
Assignee:
AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
Inventors:
Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser