Patents Assigned to AT&S (China) Co. Ltd.
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Patent number: 11963310Abstract: A method of manufacturing a component carrier includes providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least partially covering a component with a transition layer having a thickness in a range from 0.5 nm to 1 ?m, and assembling the component with the stack.Type: GrantFiled: December 31, 2020Date of Patent: April 16, 2024Assignee: AT&S(China) Co. Ltd.Inventors: Mikael Tuominen, Seok Kim Tay, Kim Liu, Artan Baftiri, Henry Guo
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Patent number: 11937369Abstract: A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.Type: GrantFiled: March 28, 2019Date of Patent: March 19, 2024Assignee: AT&S(China) Co. Ltd.Inventors: Seok Kim Tay, Azmi Ibrahim, Wenping Dai, Chunjie Shen
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Patent number: 11700690Abstract: A component carrier with a stack including an electrically insulating layer structure and an electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 ?m. A demarcation surface of the plating layer in the blind hole and facing away from the stack extends laterally outwardly from the bottom of the blind hole towards a lateral indentation and extends laterally inwardly from the indentation up to an outer end of the blind hole. An electrically conductive structure fills at least part of a volume between the plating layer and an exterior of the blind hole.Type: GrantFiled: December 6, 2021Date of Patent: July 11, 2023Assignee: AT&S (China) Co. Ltd.Inventor: Mikael Tuominen
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Patent number: 11688668Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.Type: GrantFiled: October 30, 2020Date of Patent: June 27, 2023Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Seok Kim Tay
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Patent number: 11672079Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.Type: GrantFiled: August 3, 2021Date of Patent: June 6, 2023Assignee: AT&S (China) Co. Ltd.Inventors: Nick Xin, Mikael Tuominen
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Patent number: 11670613Abstract: An arrangement, a method of manufacturing component carriers and a component carrier are provided. The arrangement includes a central carrier structure having a front side and a back side, a first layer stack having a first surface structure made of another material than the interior of the first layer stack and covered by a first release layer which is attached to the front side, and a second layer stack covered by a second release layer which is attached to the back side.Type: GrantFiled: December 14, 2020Date of Patent: June 6, 2023Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Nick Xin, Seok Kim Tay
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Patent number: 11589462Abstract: A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.Type: GrantFiled: April 30, 2019Date of Patent: February 21, 2023Assignee: AT&S(China) Co. Ltd.Inventors: Nick Xin, Mikael Andreas Tuominen, Seok Kim Tay
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Patent number: 11470714Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a via formed in the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width.Type: GrantFiled: October 9, 2020Date of Patent: October 11, 2022Assignee: AT&S (China) Co. Ltd.Inventors: Gin Feng, Sally Sun, Seok Kim Tay, Mikael Tuominen
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Patent number: 11452212Abstract: A component carrier includes an electrically insulating layer structure, a first electrically conductive layer structure, a second electrically conductive layer structure, and a laser through-hole with an electrically conductive medium filling at least part of the through-hole. The first electrically conductive layer structure covers a first side of the electrically insulating layer structure and has a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask. The second electrically conductive layer structure covers an opposed side of the electrically insulating layer structure and has a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask. The laser through-hole extends through the electrically insulating layer structure. At least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapered.Type: GrantFiled: October 20, 2020Date of Patent: September 20, 2022Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Seok Kim Tay, Sally Sun
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Patent number: 11343916Abstract: A component carrier has a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. The component includes a redistribution structure with at least one vertically protruding electrically conductive pad, and an electrically conductive material on at least part of said at least one pad. A method of manufacturing a component carrier is also disclosed.Type: GrantFiled: December 2, 2020Date of Patent: May 24, 2022Assignee: AT&S(China) Co. Ltd.Inventor: Mikael Tuominen
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Patent number: 11330706Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 ?m, in particular less than 60 ?m, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.Type: GrantFiled: November 12, 2019Date of Patent: May 10, 2022Assignee: AT&S (China) Co. Ltd.Inventors: Seok Kim Tay, Mikael Tuominen
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Patent number: 11291119Abstract: A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.Type: GrantFiled: August 3, 2020Date of Patent: March 29, 2022Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Nick Xin, Seok Kim Tay
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Patent number: 11219129Abstract: A component carrier with a stack including at least one electrically insulating layer structure and at least one electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 ?m.Type: GrantFiled: January 28, 2020Date of Patent: January 4, 2022Assignee: AT&S (China) Co. Ltd.Inventor: Mikael Tuominen
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Patent number: 11219120Abstract: A component carrier includes a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack, and at least one stress relief opening formed in each of the at least one electrically conductive layer structure arranged in the stack on one side of the component so that a portion of the stack extending from an exterior main surface of the component carrier up to a main surface of the component on said side and including the at least one stress relief opening is free of electrically conductive material.Type: GrantFiled: September 26, 2019Date of Patent: January 4, 2022Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Artan Baftiri, Nick Xin
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Patent number: 11166385Abstract: A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.Type: GrantFiled: July 18, 2019Date of Patent: November 2, 2021Assignee: AT&S (China) Co. Ltd.Inventors: Yee-Bing Ling, Kenny Cao, Jackson Xu
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Patent number: 11127670Abstract: A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component which is embedded in the stack and a stabilizing structure arranged between a stack surface of the stack and a main surface of the component. The stabilizing structure provides an interface adhesion to the main surface of the component.Type: GrantFiled: January 10, 2020Date of Patent: September 21, 2021Assignee: AT&S (China) Co. Ltd.Inventor: Artan Baftiri
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Patent number: 11116075Abstract: A component carrier with a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures and a component embedded in the stack. The plurality of electrically insulating layer structures include a first dielectric structure and a second dielectric structure differing concerning at least one physical property.Type: GrantFiled: January 29, 2020Date of Patent: September 7, 2021Assignee: AT&S (China) Co. Ltd.Inventors: Kim Liu, Nick Xin, Howard Li, Henry Guo
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Patent number: 11116083Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.Type: GrantFiled: March 28, 2017Date of Patent: September 7, 2021Assignee: AT&S (China) Co. Ltd.Inventors: Annie Tay, Mikael Tuominen
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Patent number: 11051391Abstract: A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.Type: GrantFiled: January 25, 2018Date of Patent: June 29, 2021Assignee: AT&S (China) Co. Ltd.Inventors: Mikael Tuominen, Annie Tay, Artan Baftiri
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Patent number: 11051410Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.Type: GrantFiled: September 16, 2016Date of Patent: June 29, 2021Assignee: AT&S (China) Co. Ltd.Inventors: Annie Tay, Nikolaus Bauer-Oeppinger, Giordano DiGregorio, Philips Dai