Abstract: A method of processing component carriers is disclosed. The method includes providing a plurality of arrays each comprising a plurality of component carriers, providing a plurality of separator bodies, forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body, and carrying out at least one process, in particular at least one back-end process, using the stack. A separator sheet for spacing arrays and a method of using separator sheets for spacing arrays during processing the arrays are also provided.

Abstract: A method of processing component carriers includes supplying a plurality of arrays, each comprising a plurality of component carriers, to a human operator for optical inspection, displaying a respective array on a display, and providing a user interface enabling the human operator to input a judgment concerning a quality classification of a displayed array without a mandatory manual handling of the array by the human operator.

Abstract: A component carrier includes a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the glass core and the first electrically insulating layer structure.

Abstract: A method of manufacturing component carriers is disclosed. The method includes providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, forming a first hole in a core of the stack and subsequently embedding a first component in the first hole, thereafter forming a second hole in the same core of the stack and subsequently embedding a second component in the second hole. A component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A first hole is formed in a core of the stack. A first component is embedded in the first hole. A second hole is formed in the same core of the stack and subsequently a second component is embedded in the second hole.

Abstract: A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.

Abstract: A method of manufacturing a component carrier includes forming a stack with electrically conductive layer structures and at least one electrically insulating layer structure; configuring the stack as a redistribution structure for transferring between a smaller pitch on one side of the stack towards a larger pitch on an opposing other side of the stack; arranging a first stiffening structure and a second stiffening structure in opposing surface regions of the stack. A component carrier and an electric device manufactured with the method exhibit improved stiffness and signal integrity.

Abstract: A method of manufacturing a component carrier includes a step of stacking and connecting a first component and a second component to one another to form a cluster and thereafter, a step of inserting the cluster into a cavity of a base structure. A component carrier has a base structure with a cavity; a cluster having a first component stacked and connected with a second component, wherein the cluster is arranged in the cavity. A height difference between opposing lateral sidewalls of the cluster is less than 15 ?m.

Abstract: A method of manufacturing a component carrier includes: i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, with at least one cavity formed in the stack, ii) forming a cluster by encapsulating a first electronic component and a second electronic component in a common encapsulant, and thereafter iii) placing the cluster in the common encapsulant at least partially into the cavity and v) embedding the cluster in the cavity.

Abstract: A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.

Abstract: A component carrier and a method of manufacturing the same are disclosed. The component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a component embedded in the stack. Sidewalls of the component are directly covered with an electrically conductive layer. The component carrier achieves enhanced thermal dissipation and EMI shielding characteristics and has an improved stiffness.