Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.
Type:
Grant
Filed:
February 8, 2022
Date of Patent:
January 30, 2024
Assignee:
AT&S Austria Technologie & Systemtechnik AG
Abstract: A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.
Type:
Grant
Filed:
October 5, 2018
Date of Patent:
May 23, 2023
Assignee:
AT&S Austria Technologie & Systemtechnik AG
Inventors:
Marco Gavagnin, Jonathan Silvano de Sousa
Abstract: The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).
Type:
Grant
Filed:
March 1, 2016
Date of Patent:
April 13, 2021
Assignees:
TDK Electroncis AG, AT&S Austria Technologie & Systemtechnik AG
Inventors:
Thomas Feichtinger, Oliver Dernovsek, Franz Rinner, Christian Vockenberger