Abstract: Asynchronous network interface and method of synchronisation between two applications on different computers is provided. The network interface contains snooping hardware which can be programmed to contain triggering values comprising either addresses, address ranges or other data which are to be matched. These data are termed “trip wires”. Once programmed, the interface monitors the data stream, including address data, passing through the interface for addresses and data which match the trip wires which have been set. On a match, the snooping hardware can generate interrupts, increment event counters, or perform some other application-specified action. This snooping hardware is preferably based upon Content-Addressable Memory. The invention thus provides in-band synchronisation by using synchronisation primitives which are programmable by user level applications, while still delivering high bandwidth and low latency.

Abstract: An integrated semiconductor device is formed by bonding the conductors of one fabricated semiconductor device having a substrate to the conductors on another fabricated semiconductor device having a substrate, flowing an etch-resist in the form of a photoresist between the devices, allowing the etch-resist to dry, and removing the substrate from one of the semiconductor devices. Preferably the etch-resist is retained to impart mechanical strength to the device. More specifically, a hybrid semiconductor device is formed by bonding the conductors of one or more GaAs/AlGaAs multiple quantum well modulators to conductors on an IC chip, flowing a photoresist between the modulators and the chip, allowing the photoresist to dry, and removing the substrate from the modulator.

Abstract: New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.

Abstract: The invention involves a method for making Bragg gratings in glass optical fibers, or other glass optical waveguides, which is relatively insensitive to perturbations in the actinic light used for processing. This method is suitable for mass production and lends itself well to the manufacturing environment. The invention method involves first providing an optical phase grating. An interference pattern is generated by impinging a single light beam on the grating. The optical waveguide to be processed is exposed to this interference pattern, leading to the formation of a Bragg grating in the waveguide.

Abstract: The formation of latent images in photoresist can be monitored during exposure without spurious images by directing a pulsed beam of monochromatic light onto a region of the layer being exposed and selectively detecting the diffracted light. Peak formation in the normalized diffracted intensity versus time curve indicates optimal exposure of the resist.

Abstract: A plurality of optical fibers (14-14E) are interconnected by using connectors each comprising an optoelectronic device (13-13E) adapted to be connected to an end of each optical fiber for converting optical signals to electrical signals and for converting electrical signals to optical signals. Each connector has a first contact (12-12E) having a cylindrical plug end and a cylindrical socket end located on a common axis and a transverse conductor (21) extending transversely to the axis (20) from the first contact and connected to the optoelectronic device of the connector. The plug end of each contact is adapted to fit snugly within the socket end of another first contact, whereby all of the contacts may be connected and arranged along the common axis. Each of the contacts is free to rotate with respect to other contacts to which it is connected; this permits the various optical fibers to extend in different radial directions from the axis.

Abstract: A first array of microlenses (16) on a lens substrate (15) is accurately aligned with a lens holder (20) by making a second array of microlenses (17) simultaneously with the first array. The second array of microlenses is arranged around the periphery of the lens substrate and is made solely for alignment purposes, rather than for focusing light. An array of detents (21, FIG. 2) is made in one surface of the lens holder such that, when the lens holder is abutted against the lens substrate, each microlens (17) of the second array can extend into one of the detents of the lens holder member, thereby to align the first array of microlenses with the lens holder member. The lens holder member has an opening (22) to permit light to be transmitted to or from the first array of microlenses (16). A pair of alignment pins (24) aligns the lens holder member with an array of optical fibers (12).

Abstract: An improved digital communication system, e.g., a CELP code/decoder based system, is improved for use with a wide-band signal such as a high-quality speech signal by modifying the noise weighting filter used in such systems to include a filter section which affects primarily the spectral tilt of the weighting filter in addition to a filter component reflecting formant frequency information in the input signal. Alternatively, the weighting is modified to reflect perceptual transform techniques.

Abstract: A network comprising a plurality of successively interconnected node stages where each node has an associated data connection state and includes a control element, significantly implemented as part of the node itself, for controlling the data connection state of at least one node of the following stage. The network is well suited for optical implementation and is controlled by shifting bits into the network for storage by the control elements rather than relying on spatial light modulators.

Abstract: Heat dissipation performance of a pin fin heat sink is improved by utilizing a flow guide arrangement. Flow guide members are positioned relative to the outer rows of the pin fins and longitudinal to fluid flow through the pin fin field of the heat sink. A gap between a lower edge of each flow guide member and a base surface of the heat sink forms apertures allowing potentially stagnant fluid in an interior region of the pin fin field of the heat sink to communicate with fluid flowing around the exterior of the heat sink. This causes a so-called "pump" action in which the potentially stagnant fluid is drawn along with the fluid flowing around the exterior of the heat sink.

Abstract: In a multiprocessor system (FIG. 1) wherein each adjunct processor has its own, non-shared, memory (22) the non-shared memory of each adjunct processor (11-12) comprises global memory (42) and local memory (41). All global memory of all adjunct processors is managed by a single process manager (30) of a system-wide host processor (10). Each processor's local memory is managed by its operating system kernel (31). Local memory comprises uncommitted memory (45) not allocated to any process and committed memory (46) allocated to processes. The process manager assigns processes to processors and satisfies their initial memory requirements through global memory allocations. Each kernel satisfies processes' dynamic memory allocation requests from uncommitted memory, and deallocates to uncommitted memory both memory that is dynamically requested to be deallocated and memory of terminating processes.

Abstract: Disclosed are normal metal-clad superconductive bodies (e.g., wires, ribbons) having a normal metal cladding that is porous during at least a part of the manufacture of the body. The porous cladding permits access of an ambient atmosphere to the superconductive material. Exemplarily, the superconductive material is an oxide such as a (Ba, Y) cuprate, the normal metal cladding comprises Ag particles (or Ag-coated particles), and the body is treated in an oxygen-containing atmosphere. Techniques for producing such a body are also disclosed.

Abstract: A conductive interconnection (27) on a substrate (11) is made by applying a metal-organic compound (25) to the substrate, exposing the metal-organic compound to laser beam radiation (14) in which the power level has been ramped to some specific level and, thereafter, moving the substrate with respect to the laser beam. The movement of the substrate is at an applied rate of speed such that the temperature within the metal-organic compound impinged by the laser beam is properly ramped with respect to time. This leaves a dependable metal deposition (27) which may be monitored through a viewing system (21).

Abstract: A wide variety of products are formed by compression molding of silicone materials. Although such articles are used in numerous applications, compression molding is expensive and exudation of unreacted monomers and oligomers tend to cause electrical contact failures. By employing specific polyurethanes formed from polyols and isocyanates, it is possible to form articles by reaction injection molding. This process is substantially cheaper than compression molding and yet the same properties obtainable with silicones are attained.

Abstract: Crosstalk for a directional coupler switch employing a reversed .DELTA..beta. electrode structure is reduced to a minimum by properly placing electrode sections over the waveguides to compensate interwaveguide coupling preceding an electrode section with interwaveguide coupling following the electrode section.

Abstract: Crystals of potassium titanyl phosphate suitable for device applications are grown by a hydrothermal process. By maintaining the growth temperature substantially below conventional levels, the crystal growth rate is maintained, and noble metal-lined vessels are employable.

Abstract: A low temperature procedure for depositing III-V semiconductor materials that offers the possibility of higher deposition rates together with abrupt junction formation has been found. This process involves the irradiation at a deposition substrate with a high power density radiation source of deposition gases such as organometallic materials, e.g., trimethyl gallium and trimethyl indium. By utilizing a sufficiently high power density, multiphoton processes are induced in the deposition gas that, in turn, lead to advantageous deposited materials.

Abstract: Supported intermetallic compounds are produced by a two-step process. In the first step, a supported metal is formed, for example, by solvating a metallic salt such as nickel nitrate and applying it to a support medium. The treated support body is then heated in the presence of a reducing agent to produce elemental metal. The supported metal is then treated with a reactive organometallic or metal hydride compound to yield a supported intermetallic compound. For example, supported elemental nickel is treated with hexamethyldisilane to produce supported nickel silicide.