Abstract: A semiconductor laser mount is disclosed for use in high frequency (>500 Mb/s) applications. The mount comprises a stripline transmission path and resistive element formed in series with the optical device. Since the current sources used to modulate optical devices at these bit rates have a large impedance relative to that of the optical devices, the stripline is used as an impedance controlling network to provide frequency independent coupling from the signal source to the device and the resistive element is used to compensate the variation of the impedance of the device to essentially match that of the stripline. Since the impedance of individual optical devices may vary, the resistive element is sized to provide optimum matching. Both the stripline and resistive element are integrated with the mount material to form a monolithic structure.

Abstract: A cable (20) which is particularly suited to the transmission of substantially error-free data at relatively high rates over relatively long distances includes at least two pairs of individually insulated conductors (42--43). Each pair of individually insulated conductors is enclosed individually in its own tubular member (51) comprising a plastic material. A metallic shield (60) encloses the tubular members, and in a preferred embodiment, a plastic jacket (80) encloses the shield. In the preferred embodiment, two pairs of voice communications conductors are disposed at opposed locations between the shield and the jacket. The thickness of the tubular member is such that each insulated conductor of each twisted pair is caused to be spaced from the shield a distance which is not less than one half the diameter of the metallic wire portion of each pair enclosed by the tubular member.

Abstract: A telephone cord employs as an insulator for the conductors therein an extrudable blend of a styrene-ethylenebutylene-styrene copolymer with polypropylene.

Abstract: Electrically conductive paths are produced on a polymeric substrate by laser writing, i.e., by tracing desired paths on the substrate by a laser beam. The resulting paths comprise electrically conductive carbon as produced by thermal decomposition of substrate surface material; the paths can serve; e.g., as electrical interconnections akin to printed circuitry on a wiring board. Optionally, the conductivity of paths can be enhanced by electroplating a suitable conductor metal or alloy onto the paths.

Abstract: In an apparatus (20) for end finishing an assembly (22) comprising a plurality of lightguide fibers (23--23) positioned between two silicon chips (26--26), a tool carriage (45) is moved past the assembly which at first is held in a fixed position with respect to a path of travel of the carriage. A profiling wheel (110) which is mounted rotatably on the carriage severs a portion of the chips and fibers from the assembly to provide an end portion having a predetermined end configuration. Subsequently, a grinding wheel (131) and a polishing wheel (141) are moved past the newly formed end of the assembly to grind and polish a surface of the end portion and ends of the fibers which terminate in the surface. These last two operations are accomplished while forces are applied to the assembly to bias it toward the tool carriage to provide a controlled pressure and avoid the removal of excess material from the surface and fibers.

Abstract: A bonded ASP cable includes a multiconductor core which is filled with a waterproofing material. The core is enclosed by a plastic layer (28) which is flooded with a waterproofing material. Wrapped longitudinally about the plastic layer is a corrugated inner shield (31) having a longitudinal seam (35) and having an outer surface covered with a waterproofing material. The inner shield is enclosed by a corrugated outer shield (36) which has an overlapped longitudinal seam (38) and which has an outer surface coated with a layer of an adhesive material. As the outer shield is being formed, a sealant material is introduced into engagement with the inner shield in the vicinity of the longitudinal edge portions of the outer shield. Then as the longitudinal edge portions of the outer shield are overlapped and engaged with each other, the sealant material is caused to flow into cavities between the two shields adjacent to the seam of the outer shield to form a gasket (66).

Abstract: A power adapter is disclosed for use in connecting electrical power to a telephone station via a cross-connect jack. The power adapter has a plug-end for mating with the cross-connect field and a jack-end for receiving a cross-connect patch cord. The power adapter includes a two-conductor permanently attached power cord. Bent wire technology is used to connect the contacts of the receiving jack with the contacts of the plug while blade insertion technology is used for making contact with the ends of the power conductors.

Abstract: The epoxy resin stabilizing systems in combination with cadmium containing stabilizers employed in PVC compounds are replaceable without affecting other properties of the polymer by utilizing a specific additive mixture. In particular, a complex ester of oleic acid and a diglycerol ester of oleic acid are employed in conjunction with a calcium-zinc composition. The resulting system yields excellent processing and long-term stability without significantly affecting other properties such as color stability and flame retardancy.

Abstract: A Schmitt trigger circuit 10 includes a pair of transmission gates 20, 22 connected, respectively, between a pair of threshold voltages V.sub.tH, V.sub.tL and the threshold input port 16 of a comparator 12. The control lead of one transmission gate 20 is connected to the output 18 of the comparator 12 through an inverter 24. The control lead of the other transmission gate 22 is connected directly to the output 18 of the comparator 12. The other input port 14 of the comparator 12 receives the signal input. Also disclosed is a circuit 26 for generating the reference voltages V.sub.tH, V.sub.tL. The circuit 26 includes an operational amplifier 28 driving a complementary pair of current mirrors (M1, M3, M5; M4, M6) which force current through a pair of resistors (R.sub.H, R.sub.L) to ground potential. The resistors (R.sub.H, R.sub.L) provide stable reference potentials.

Abstract: An electronic tone ringer provides a distinctive ringing capability through the use of two oscillators which allow selection of four tones and four modulation rates. In determining the type of tone generated, formattable inputs select between frequency shift or amplitude modulation modes or disabling the modulation altogether to generate a single tone. In the frequency shift mode, two fundamental frequencies are generated which are related by a predetermined ratio, the output tone alternating between these two frequencies at one of four selectable modulation rates. In the amplitude modulation mode, a single frequency is switched on and off at the selected modulation rate. All of the tones are produced with a duty cycle appropriate for driving an electromagnetic acoustic transducer.

Abstract: The use of a particular configuration in a downstream etching apparatus and technique allows the rapid and economical treatment of a plurality of semiconductor substrates. Additionally, through the use of this technique, global and localized loading effects are avoided. The downstream apparatus utilizes a discharge region that is relatively large compared to the volume occupied by the substrates. Additionally, the concentration of the etchant species in the effluent is maintained at a level that is of the same order as that produced in the discharge region.

Abstract: Disclosed are magnetically soft ferritic multiphase Fe-Cr-Ni alloys containing at least about 82 weight percent Fe, between about 3 and about 10 weight percent Cr, and between about 2 and about 8 weight percent Ni, a method for producing such alloys, and devices comprising such an alloy body. The method comprises a low-temperature anneal in the (.alpha.+.gamma.) region of the Fe-Cr-Ni phase diagram. Inventive alloys typically have a coercive force H.sub.c no more than about 3.0 Oe, preferably no more than about 2.0 Oe, a maximum permeability .mu..sub.m of at least about 1500 G/Oe, preferably at least about 2500 G/Oe, and contain at least about 5 volume percent non-.alpha.-phase material, typically .alpha.'- and .gamma.-phase material. Inventive alloys typically also have yield strength to 0.2% offset of at least about 26.10.sup.7 Pa (40.10.sup.3 psi), elongation to fracture of at least about 15%, good formability and rust resistance.

Abstract: Photoelectrochemical processing of semiconductors is highly desirable because of its versatility and simplicity. The invention is a photoelectrochemical etching procedure for n-type silicon in which an alcohol based solution of hydrofluoric acid is used as the electrolyte. This procedure is useful for the fabrication of a variety of silicon devices.