Abstract: A photomask (60) used to form patterns on a resist coated semiconductor wafer is comprised of a light transmissive baseplate (62) having a thin metallic pattern (63) thereon; a plasma deposited coating (66) covering the patterned baseplate (62); a light transmissive, planar coverplate (68) in intimate contact with the coating (66) with an index matching fluid (72) interposed therebetween.

Abstract: A method of producing a high color contrast between nickel and/or copper or their various alloys and a noble metal or noble metal alloy such as in electrical contacts having a nickel or copper base with an overlay of a noble metal or a noble metal alloy bonded to the surface of the base. By making the contact one electrode in an aqueous solution of a readily soluable ionizable solute and impressing a low AC voltage across the solution, a reaction occurs which makes the base of the electrical contact easily visually distinguishable from the metal overlay.

Abstract: A method for detecting the end point of the plasma etching of a pattern (36) in an aluminum layer (33) on a silicon wafer (16). The pattern (36) and portions of a Fresnel zone plate (30) are simultaneously etched in the aluminum layer (33). The intensity of the light reflected from the Fresnel zone plate (30) during plasma etching is monitored and the etching process terminated when the intensity falls below a predetermined level.

Abstract: A pair of optical isolator circuits (18, 56) associated with a subscriber's telephone line are utilized to automatically connect and disconnect a speakerphone to the telephone line. Receipt of each calling ringing signal operates the first optical isolator (18) and a first one shot multivibrator (28) to generate and apply counting pulses to a counter (37). Upon receipt of a predetermined count, the counter acts to energize a relay (51) to connect the speakerphone and the second monitoring optical isolator to the telephone line. Upon either party going "on hook" at the completion of the call, the second monitoring optical isolator (56) is interrupted which results in the operation of a second one shot multivibrator to generate a pulse to reset the counter whereupon the relay is released to disconnect the speakerphone and the second monitoring optical isolator from the telephone line.

Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.

Abstract: A diverter and coextrusion diverter are described which include means for adjusting the cavity of the diverter so as to control the uniformity of extrudate exiting the diverter. The diverter including a gap having beveled opposing faces.

Abstract: A wall outlet (20), which facilitates the interconnection of lengths of inside wiring to a network interface device, includes provisions for receiving a modular plug (31) which terminates a cord (32) that is connected to customer station equipment. The wall outlet includes a tricoupler (30) and a cover (25). The tricoupler includes a housing (80) having first and second generally opposed plug-receiving cavities (82, 83) and a third cavity (87). A plurality of metallic wire-like contact elements (90-90) are disposed in the housing of the tricoupler and are engaged by blade-like terminals (60-60) of modular plugs which are inserted into the cavities. The cover includes latching tabs (164-164) which are adapted to be received in grooves (163-163) of the tricoupler housing to secure the tricoupler to the cover.

Abstract: A workpiece such as a minute stud (34) is aligned to a small porcelain body (36) to form a guide (40) for processing lightwaves. Such alignment includes registering a target (30) of an avalanche photodiode in a chip (32) on the stud (34) to a fiber receiving bore (44) in the body (36). Radiation, preferably in the form of a beam of light, is directed to a first end of the bore (44). Some portion of the light is redirected sufficiently to pass longitudinally along the surfaces of the bore (44) and thereby project an image from a second end of the body (36). The image is advantageously in the form of a halo which is enlarged and displayed on a video monitor (100). The stud (34) is manipulated about the first end of the bore (44) by operating micropositioning fixtures (66 and 68). The target (30) in chip (32) reflects light sufficiently to cast a preferably dark image of the target ( 30) through the bore (44) and its image onto the video monitor (100).

Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.

Abstract: An extrusion system is provided for covering a conductor (14) with a crystalline thermoplastic elastomer insulating material. The plastic material is tubed onto the conductor by apparatus which includes a core tube (61) that is mounted in an extruder crosshead (41) such that its free end is positioned within the interior of a die (81, 101) and is spaced from an orifice of the die a predetermined percentage of the land length of the die. A flow passage between the core tube (61) and a wall which defines the die cavity is controlled in accordance with the relative value of the thermal energy which is released by the insulating material at the onset of crystallization. In one arrangement, which has been found to be suitable for a crystalline thermoplastic elastomer having a relatively high value of released thermal energy, the die cavity and the core tube are arranged to provide a gradually converging path toward the die opening.

Abstract: A mini-oscillator assembly (20) is formed by initially bonding ribbon leads (34) to contact pads (32) on a planar substrate (26) of a hybrid integrated circuit device (22) such that the leads project from the substrate in the plane thereof. Inverted V-shaped notches (50) then are formed in the ribbon leads (34) as the leads are cut to length. The ribbon leads (34) then are formed over the substrate (26) so that the V-shaped notches (50) face away from the substrate (26) and are aligned with one another on opposite sides of a plane extending from an imaginary line (52) extending between and interconnecting the substrate contact pads (32). Wire leads (38) of a crystal resonator plate (24) then are soldered in the V-shaped notches (50) to form the mini-oscillator assembly (20).

Abstract: An argon-nitrogen sputtering gas mixture is introduced into a cylindrical sputtering chamber (20) at essentially the geometric center of the chamber. The gas mixture then disperses through open areas in the chamber about upper and lower edges of a cylindrical tantalum target (24) and homogeneously into a sputtering area (30) between the target and a plurality of substrates (12) on a rotatable carrousel (28). As tantalum material then is sputtered from the target onto the substrates (12), tantalum films (16), which are uniformly doped with nitrogen, are formed on the substrates. A target cooling cell assembly (26), comprising a pair of C-shaped cooling cells (92) having independent cooling water input-and-return systems (95), provides improved cooling of the target during the sputtering operation.