Abstract: Apparatus for decontaminating certain types of semiconductor wafer handling equipment is disclosed. The apparatus includes a frame having structure for applying decontaminating and electrostatic elimination fluid to handling equipment. It includes a first chamber and a second chamber. The first chamber removes contaminants from handling equipment and restricts the removed contaminants to the first chamber. The second chamber includes structure for drying handling equipment. The apparatus further includes structure for removing static from dried handling equipment.