Abstract: A test board for semiconductor devices is provided which contains a plurality of semiconductor devices and is loaded into a testing apparatus. The test board includes: a receiving part formed with a plurality of semiconductor device receiving grooves that respectively receive a plurality of semiconductor devices; and a lid part removably attached to the receiving part, wherein the lid part includes a heat transfer portion having a first heat transfer end portion, which is exposed on the outside of the lid part while the lid part is attached to the receiving part, and a second heat transfer end portion, which extends from the first heat transfer end portion and is exposed to a temperature regulating region defined to include at least one of the plurality of semiconductor device receiving grooves.

Abstract: A system for a memory module mounting test according to an embodiment of the present disclosure includes: a test tray on which a memory module array in which a plurality of memory modules are positioned in a predetermined pattern is loaded; a tester in which the test tray is able to be seated and a socket corresponding to the predetermined pattern is formed to perform a test on the memory module array; a transfer for transferring the test tray from an initial position to a seating position where the test tray is seated in the tester; and a mounter for mounting the memory module array transferred to the seating position in the socket.

Abstract: A system for testing the performance of a device includes: a tester including a plurality of sockets capable of making electrical contact with a plurality of devices inserted therein, that tests the performance of the devices; a pusher including a plurality of push bodies for pushing the devices in a direction of the sockets, by which the plurality of devices are inserted into the plurality of sockets; a first temperature regulator which maintains the temperature of a first region within a predetermined temperature range during the test on the plurality of devices, the first region being a space between some of the plurality of sockets and the pusher; and a second temperature regulator which maintains the temperature of a second region within a predetermined temperature range during the test on the plurality of devices, the second region being a space between some other sockets and the pusher.

Abstract: The present invention relates to an electronic component test handler comprising: a hand configured to pick up and transfer a plurality of devices; and a scanner configured to scan a region of a movement path of a device picked up by the hand at a predetermined angle. The electronic component test handler having a flying scan function according to the present invention is capable of scanning during a transfer process without a change in position after picking up a device, and thus, operations and time required for the scanning may be reduced, thereby improving efficiency.

Abstract: A memory module system level tester device provides contact between the motherboard and the memory modules by using a test tray, thereby minimizing a time required for attaching and detaching the memory modules and omitting an additional configuration for attaching and detaching the memory modules. Accordingly, space limitations can be minimized, and as a result, test units can be arranged in two or more stages in the vertical direction to configure a compact layout to thereby increase space efficiency.

Abstract: The present disclosure related to a stacker of an electric device test hander comprising an upper stacker and a lower stacker. Stacker modules provided in the upper stacker can be opened and closed by being moved horizontally from the frame, and each of stacker modules can give and receive a plurality of user trays to and from the lower stacker in closed position. According to present disclosure when goods are being transferred to and from the outside, the user trays can move freely between the loading parts disposed on the upper and lower sides. Thus, the dependence on the visitation cycle of an external robot and the replacement amounts of the user trays can be lowered to improve ease of operation.

Abstract: The present invention relates to a test handler having a hand teaching function and a hand teaching method using same, the test handler comprising: a plurality of sites where devices are picked up or placed; reference points disposed adjacent to the plurality of sites, respectively; and a hand configured to transfer a device and including a sensor unit configured to calculate the position of a reference point in a non-contact manner. By the electronic component test handler having a hand teaching function and the hand teaching method using same, according to the present invention, an error which may occur due to repeated use or a position error required to be corrected according to exchange of kits can be automatically corrected using a reference groove, so that a separate work for position correction is not required and thus convenience and efficiency can be improved.