Abstract: A head that moves across a surface of a mask, which includes a plurality of apertures for disposing conductive balls on a substrate, whereby, while the head is rotating about an axis that is perpendicular to the mask, the axis moves across the surface of the mask. The head includes a gatherer that gathers the conductive balls into a circular area that is smaller than the surface of the mask and disposed around a center of rotation of the head, the conductive balls being gathered from an area around the circular area when the head rotates.

Abstract: A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.

Abstract: A ball mounting apparatus and method for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, a force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.

Abstract: A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.

Abstract: A ball mounting apparatus for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.

Abstract: A ball mounting method for mounting a plurality of balls held by a head onto a workpiece. The head is clamped such that a clamping surface mounted to the head is engaged with a rigid lower positioning stop, and then moved above a ball supply section. The balls are held on the head, and the head is moved above the workpiece. The clamping force is then released so that the clamping surface does not engage the lower stop, and the head is counterbalanced between the lower positioning stop and an upper positioning stop. While the head is unclamped and counterbalanced, the balls are mounted on the workpiece. The head is then clamped and moved above the ball supply section again.

Abstract: A cream solder printing apparatus is disclosed which includes a positioning unit for positioning a workpiece 1, a mask 9 having a plurality of opening portions 31, a filling unit for filling cream solder 11 in the opening positions, a pressurizing unit composed of a pressure head 12 having a pressure container 13 and a gas charge/discharge pipe 14, a position registration unit for aligning the workpiece, the mask and the pressure head, and a moving means for peeling the mask away from the workpiece. A lower surface 27 of said pressure head has holes at positions corresponding to the opening portions.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.