Patents Assigned to ATI TECHNOLOGIES ULO
  • Sharing package pins in a multi-chip module (MCM)
    Patent number: 11886370
    Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: January 30, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULO
    Inventors: Yulei Shen, Tyrone Tung Huang, Chen-Kuan Hong