Patents Assigned to ATI TECHNOOGIES ULC
  • Semiconductor chip having stepped conductive pillars
    Patent number: 11955447
    Abstract: In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: April 9, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOOGIES ULC
    Inventors: Suming Hu, Farshad Ghahghahi